A nonlinear viscoelastic damage accumulation model with a physical approach is presented with a view to describing stress relaxation in amorphous and partially crystalline polymers. The deformation is represented as stress-aided transition through a series of symmetrical energy barriers. There is also a stress threshold, introduced by the authors and representing an asymptotic residual stress below which relaxation does not occur. The model comprises three parameters: an activation volume, V; a product of several parameters with physical meaning, A (only the combination of A and V in the form of the relaxation time constant can be reconstructed from the present set of experiments); and the relaxation threshold. It allows a practically unlimited number of energy barriers. The damage depends on the stress history. Experimental data were collected on stress relaxation of three polymers at different temperatures. The experiments involved bending of a polymer strip within a metal cylinder and measurement of the radius of curvature after removal of the strip from the cylinder, using a specially-developed method. The measured radii ranged from infinity to 1.5 cm, and the obtained data were fitted to the model. The results show that the residual stress and other model parameters are temperature-dependent.
Skip Nav Destination
Article navigation
September 2002
Papers On Reliability
Damage Accumulation During Stress Relaxation of Polymer Films in Bending
D. Ingman,
D. Ingman
Quality Assurance and Reliability, Technion-Israel Institute of Technology, Haifa, 32000 Israel
Search for other works by this author on:
Y. Michlin
Y. Michlin
Quality Assurance and Reliability, Technion-Israel Institute of Technology, Haifa, 32000 Israel
Search for other works by this author on:
D. Ingman
Quality Assurance and Reliability, Technion-Israel Institute of Technology, Haifa, 32000 Israel
Y. Michlin
Quality Assurance and Reliability, Technion-Israel Institute of Technology, Haifa, 32000 Israel
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD October 19, 2000. Associate Editor: S. M. Heinrich.
J. Electron. Packag. Sep 2002, 124(3): 260-265 (6 pages)
Published Online: July 26, 2002
Article history
Received:
October 19, 2000
Online:
July 26, 2002
Citation
Ingman , D., and Michlin, Y. (July 26, 2002). "Damage Accumulation During Stress Relaxation of Polymer Films in Bending ." ASME. J. Electron. Packag. September 2002; 124(3): 260–265. https://doi.org/10.1115/1.1463731
Download citation file:
Get Email Alerts
Cited By
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Related Articles
Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
J. Electron. Packag (March,2005)
State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
J. Electron. Packag (December,2005)
Development of a Fiberoptic Distributive Shear/Pressure Sensor
J. Med. Devices (June,2009)
Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity
J. Electron. Packag (June,1998)
Related Proceedings Papers
Related Chapters
Linear Viscoelasticity
Introduction to Plastics Engineering
Processing/Structure/Properties Relationships in Polymer Blends for the Development of Functional Polymer Foams
Advances in Multidisciplinary Engineering
Understanding the Problem
Design and Application of the Worm Gear