A reliability model is established to study thermal fatigue behavior of solder joints in plastic ball grid array (PBGA) assemblies. The model is able to simulate a configuration with a large number of warpage affected solder joints. For efficient computation, regression models are used to calculate the force acting on each solder joint to determine its height under different warpage conditions. With the height and specified solder parameters, the shapes of selected solder joints are calculated using the Surface Evolver. In addition, the displacements of these solder joints can be determined by a macro model using equivalent beams to represent hundreds of solder joints. With the shapes and displacements, three-dimensional micro models for the selected joints are established to compute strain energy densities during temperature cycling. The energy densities can be used to estimate fatigue lives through an empirical correlation. Two PBGA assemblies with 72-I/O cavity-up and 540-I/O cavity-down packages are studied using the reliability model. Silicon chip size and substrate thickness are critical to solder fatigue in the cavity-up assembly. Their effects are reduced substantially for the cavity-down assembly, which is more reliable due to small global thermal mismatch. However, its reliability is strongly affected by the warpage. The warpage changes the shapes of solder joints and can reduce the corner joint’s fatigue life from 20,000 to 7800 temperature cycles for an arch-type warpage of 0.28 mm across a 42.5 mm×42.5 mm region.
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September 2002
Papers On Reliability
Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints
Y. W. Chan,
Y. W. Chan
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309
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T. H. Ju,
T. H. Ju
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309
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Saeed A. Hareb,
Saeed A. Hareb
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309
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Y. C. Lee,
Y. C. Lee
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309
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Jih-Shun Wu,
Jih-Shun Wu
Semi-Custom Design and Manufacturing, Boulder, CO 80309
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Mirng-Ji Lii
Mirng-Ji Lii
Intel Corporation, Chandler, AZ
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Y. W. Chan
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309
T. H. Ju
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309
Saeed A. Hareb
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309
Y. C. Lee
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309
Jih-Shun Wu
Semi-Custom Design and Manufacturing, Boulder, CO 80309
Mirng-Ji Lii
Intel Corporation, Chandler, AZ
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD September 24, 1997. Associate Editor: S. M. Heinrich.
J. Electron. Packag. Sep 2002, 124(3): 246-253 (8 pages)
Published Online: July 26, 2002
Article history
Online:
July 26, 2002
Citation
Chan , Y. W., Ju , T. H., Hareb , S. A., Lee, Y. C., Wu, J., and Lii, M. (July 26, 2002). "Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints ." ASME. J. Electron. Packag. September 2002; 124(3): 246–253. https://doi.org/10.1115/1.1451844
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