3D finite element modeling of thermal emulator cube and its composition consisting of composite stack of multi-layer chip are developed. Thermal analysis of the Multi-Chip Module consisting of 16 alternate layers Si processor and heat sink layers with Si spacers and AlN ceramic cap is undertaken. The various alternatives for design of the emulator cubes such as thermal cube floating in free-space, thermal cube-on-substrate, thermal cube-on-flex cable with a continuous joint of solder and thermal cube embedded in rectangular Si-spacer are investigated for their heat extraction capability. Thermal modeling of a composite structural unit stack of chip offers first hand information as to the operating performance of the entire thermal emulator cube to be used in the construction of buffer cube. The scientific understanding of the mode of heat transfer of the emulator cube, heat extraction of the various heat sink materials, ceramic and the metallic substrates are investigated. A thin sheet of ceramic (AlN) substrate is at least three times more effective in extraction of heat than thick block of steel under similar conditions. The homogeneous and heterogeneous nature of the composite structure of thermal emulator in heat transfer is analyzed. The primary and secondary hotspots in thermal cubes with AlN heat sink are found in thermal simulations. The mode of heat transfer advances normal to lateral and transverse directions of stacking from the central core of the cube towards the outward face. The sharp corners of the cube typically exhibit edge convection due to chilling effect. Buffer-on-flex cable is modeled with a continuous solder joint and its further improvement with alternate hinges of solder joints and micro-channels is proposed for enhanced heat transfer analysis. The embedded emulator cubes are developed for thermal analysis of the optical layers on top of buffer. The optical layers with an interconnection of solder joints on top of the embedded emulator cubes coupled with micro-channels and hinged solder joints will be used for further enhanced heat transfer and higher dissipation of heat resulting in efficient and cost effective thermal management technique.
Skip Nav Destination
Article navigation
September 2002
Technical Papers
Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
Shiva P. Gadag,
Shiva P. Gadag
Mechanical Engineering Department, University of Colorado at Boulder, Boulder, CO 80309
Search for other works by this author on:
Susan K. Patra,
Susan K. Patra
Optical Micro-Machines Inc., San Diego, CA 92122
Search for other works by this author on:
Volkan Ozguz,
Volkan Ozguz
Irvine Sensors Corporation, Costa Mesa, CA 92626
Search for other works by this author on:
Phillipe Marchand,
Phillipe Marchand
Optical Micro-Machines Inc., San Diego, CA 92122
Search for other works by this author on:
Sadik Esener
Sadik Esener
Electrical and Computer Engineering Department, University of California, San Diego, CA 92093-0407
Search for other works by this author on:
Shiva P. Gadag
Mechanical Engineering Department, University of Colorado at Boulder, Boulder, CO 80309
Susan K. Patra
Optical Micro-Machines Inc., San Diego, CA 92122
Volkan Ozguz
Irvine Sensors Corporation, Costa Mesa, CA 92626
Phillipe Marchand
Optical Micro-Machines Inc., San Diego, CA 92122
Sadik Esener
Electrical and Computer Engineering Department, University of California, San Diego, CA 92093-0407
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD September 5, 2000. Associate Editor: B. Michel.
J. Electron. Packag. Sep 2002, 124(3): 198-204 (7 pages)
Published Online: July 26, 2002
Article history
Received:
September 5, 2000
Online:
July 26, 2002
Citation
Gadag, S. P., Patra, S. K., Ozguz, V., Marchand, P., and Esener, S. (July 26, 2002). "Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor ." ASME. J. Electron. Packag. September 2002; 124(3): 198–204. https://doi.org/10.1115/1.1481894
Download citation file:
Get Email Alerts
Cited By
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Related Articles
Compact Thermal Models: A Global Approach
J. Electron. Packag (December,2008)
Thermal Interfacing Techniques for Electronic Equipment—A Perspective
J. Electron. Packag (June,2003)
On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
J. Electron. Packag (September,2004)
A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages
J. Heat Transfer (November,1998)
Related Proceedings Papers
Related Chapters
Introduction
Thermal Management of Microelectronic Equipment
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment