Based on experimental data, a simple R–C (thermal resistance–heat capacitance) model with software precaution strategies are proposed in this paper to predict the steady-state temperature of the circuit in an electronic packaging in real time. Further developments on the new methodology lead to real time monitoring if input power and/or the environment are changing during operations. It is concluded that the new methodologies, which make the over-temperature prediction much more reliable, efficient, sensible, and faster, can be easily employed for over-temperature protection designs on electronic packaging. [S1043-7398(00)00301-7]

Issue Section:
Technical Papers
Keywords:
thermal management (packaging), cooling, integrated circuit packaging, chip scale packaging, temperature distribution, circuit simulation
Topics:
Steady state, Temperature, Transients (Dynamics), Circuits, Convection
1.
Suarez
,
J. E.
,
Johnson
,
B. E.
, and
El-Kareh
,
B.
,
1992
, “
Thermal Stability of Polysilicon Resistance
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
15
, No.
3
, pp.
386
–
392
.
2.
Lake Shore™ Cryotronics, Inc., Calibration Report 287418, Westerville, OH, U.S.A.
3.
Min
,
Y. J.
,
Palisoc
,
A. L.
, and
Lee
,
C. C.
,
1990
, “
Transient-Thermal Study of Semiconductor Devices
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
13
, No.
4
, pp.
980
–
988
.
4.
Gibbon
,
G.
,
1970
, “
Transient Temperature Response of an Avalanche Diode
,”
Solid-State Electron.
,
13
, pp.
799
–
806
.
5.
Krieger
,
G.
,
1987
, “
Thermal Response of Integrated Circuit Input Devices to an Electrostatics Energy Pulse
,”
IEEE Trans. Electron Devices
,
ED-34
, pp.
877
–
881
.
6.
SEMI G43-87, 1992, “Test Method Junction-to-Case Thermal Resistance of Measurements Molded-Plastic Packages,” SEMI, pp. 205–208.
7.
SEMI G38-87, 1987, “Test Method Still-Air Force-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages,” SEMI, pp. 173–178.
Copyright © 2000
 by ASME
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