This paper explores the use of liquid immersion and vapor condensation curing as alternatives to conventional hot air oven curing of flip chip on board underfill. Heat transfer results suggest that both the liquid immersion and vapor condensation heating result in reduced cure times due to higher heat transfer results associated with these two techniques. Preliminary reliability studies Suggest that the two proposed rapid curing methods do not result in any increased failure rates or different failure mechanisms. In almost all the samples the failure mode was delamination of the underfill followed by solder fatigue failure.

Issue Section:
Technical Papers
Topics:
Hardening (Curing), Condensation, Failure mechanisms, Heat transfer, Vapors, Delamination, Failure, Fatigue failure, Flip-chip, Heating, Ovens, Reliability, Solders
1.
Anderson, B., Ahmad, I., Tucker, D., Goldstein, S., Fathi, Z., Ramamoorthy, A., Pal, S., and Mead, P., 1998, “Rapid Processing and Properties Evaluation of Flip-Chip Underfills,” Proceedings of the Technical Program, NEPCON West ’98, Vol. 3, p. 1043.
2.
Chen, W. T., Reed, D., Quested, D., and Sammakia, B. G., 1997, “Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry,” Proceedings, Applications of Fracture Mechanics in Electronics Packaging, AMD-Vol. 222/EEP, Vol. 20, ASME, New York, pp. 183–192.
3.
Churchill
S. W.
, and
Chu
H. H. S.
,
1975
, “
Correlating Equations for Laminar and Turbulent Free Convection From a Vertical Plate
,”
International Journal of Heat and Mass Transfer
, Vol.
18
, pp.
1323
–
1329
.
4.
Chu, T. Y., Mollendorf, J. C., and Pfahl, R. C. Jr., 1974, “Soldering Using Condensation Heat Transfer,” Proceedings of the Technical Program, NEPCON West, Anaheim, CA.
5.
Deissler, R. G., 1951, “Analytical Investigation of Fully Developed Laminar Flow in Tubes With Heat Transfer With Fluid Properties Variable Around the Radius,” NACA TN 2410.
6.
Fathi, Z., Tucker, D., Ahmad, I., Yaeger, E., Konarski, M., Crane, L., and Heaton, J., 1998, “Innovative Curing of High Reliability Advanced Polymeric Encapsulants,” Proceedings, Technical Program, NEPCON West ’98, Vol. 3, p. 1084.
7.
Giesler
J.
,
O’Malley
G.
,
Williams
M.
, and
Machuga
S.
,
1994
, “
Flip Chip on Board Connection Technology: Process Characterization and Reliability
,”
IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B
, Vol.
17
, No.
3
, pp.
256
–
263
.
8.
Incropera, F. P., and DeWitt, D. P., 1990, Fundamentals of Heat and Mass Transfer, 3rd ed., John Wiley and Sons, New York.
9.
Mahajan
R. L.
,
Chu
T. Y.
, and
Dickinson
D. A.
,
1991
, “
An Experimental Study of Laminar Film Condensation With Stefan Number Greater than Unity
,”
ASME Journal of Heat Transfer
, Vol.
113
, pp.
472
–
478
.
10.
Nusselt
W.
,
1916
, “
Die Operflaschenkondensation des Wasserdampfes
,”
J. ver Deutsch, Ing.
, Vol.
60
, p.
541
541
.
11.
O’Malley
G.
,
Giesler
J.
, and
Machuga
S.
,
1994
, “
The Importance of Material Selection for Flip Chip on Board Assemblies
,”
IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B
, Vol.
17
, No.
3
, pp.
248
–
255
.
12.
Pearson, R. A., Lloyd, R. B., and Bagheri, R., 1996, “Adhesion Issues at Epoxy Underfill/Solder Mask Interfaces,” Proceedings of the Technical Program, Surface Mount International, pp. 329–335.
13.
Powell
D. O.
, and
Trivedi
A. K.
,
1993
, “
Flip-Chip on FR-4 Integrated Circuit Packaging
,”
IEEE Transactions on Components, Packaging and Manufacturing Technology—Part C
, Vol.
20
, No.
1
, pp.
182
–
186
.
14.
Rohsenow
W. M.
,
1956
, “
Heat Transfer and Temperature Distribution in Laminar Film Condensation
,”
Trans. ASME
, Vol.
78
, pp.
1645
–
1648
.
15.
Schwiebert
M.
, and
Leong
W.
,
1996
, “
Underfill Flow as Viscous Flow Between Parallel Plates Driven by Capillary Action
,”
IEEE Transactions on Components, Packaging and Manufacturing Technology—Part C
, Vol.
19
, No.
2
, pp.
133
–
137
.
16.
Tran, S. K., Questad, D. L., and Sammakia, B. G., 1998, “Adhesion Issues in Flip-Chip on Organic Modules,” Proceedings ITHERM, Intersociety Conference on Thermal Phenomena, Seattle, WA, pp. 263–268.
17.
Wang
D. W.
, and
Papthomas
K. I.
,
1993
, “
Encapsulant for Fatigue Life Enhancement of Controlled-Collapse Chip Connection (C4)
,”
IEEE Transactions on Components, Hybrids and Manufacturing Technology
, Vol.
16
, No.
8
, pp.
863
–
867
.
18.
Wenger, G. M., and Mahajan, R. L., 1979, “Condensation Soldering Technology—Part I: Condensation Soldering Fluids and Heat Transfer,” Insulations/Circuits, pp. 133–139.
19.
Wun, B., and Lau, J., 1994, “Characterization and Evaluation of the Underfill Encapsulants for Flip Chip Assembly,” IEEE/CPMT International Electronic Manufacturing Technology Symposium, pp. 139–146.
20.
Yang
K. T.
,
1962
, “
Laminar Forced Convection of Liquids in Tubes With Variable Viscosity
,”
ASME Journal of Heat Transfer
, Vol.
84
, pp.
353
–
362
.
This content is only available via PDF.
Copyright © 1999
 by The American Society of Mechanical Engineers
You do not currently have access to this content.