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Just Accepted Manuscript
Research-Article August 1, 2022
An Automatic Fem-bem Coupling Method for Elastic-plastic Problems of Multiscale Structures in Electronic Packaging
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4055125
Research-Article July 26, 2022
Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4055094
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