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December 2024, Volume 146, Issue 4

About the Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Read more...

Shi-Wei Ricky Lee,
The Hong Kong University of Science & Technology
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Impact Factor
2.2
Open Access

Open Access

The ASME Open Journal of Engineering (AOJE) is a rapid turnaround, multidisciplinary, open access, and rigorously peer-reviewed publication that expands the ASME Journal Program to offer original research across the broad spectrum of all ASME technical communities.

Call for Papers

Announcements and Call For Papers

ASME continuously publishes Special Issues in emerging areas. Stay up to date on the latest call for papers if you’d like to submit.

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Why Publish in ASME Journals?

Here are 10 important reasons to choose ASME. Become part of the ASME author community and its more than 140-year tradition of promoting the art, science, and practice of multidisciplinary engineering and the related sciences around the globe.

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