Effect of filling ratio and tilt angle on the performance of a mini loop thermosyphon

[+] Author and Article Information
Trijo Tharayil

Department of Mechanical Engineering, Sree Buddha College of Engineering, Pattoor Alappuzha, Kerala 690529 India trijotharayil@gmail.com

Neha Gitty

Department of Mechanical Engineering, Karunya Institute of Technology and Sciences Coimbatore, Tamil Nadu 641114 India gittyneha@gmail.com

Godson Asirvatham

School of Mechanical Sciences Karunya University Coimbatore, Tamil Nadu 641114 India godasir@yahoo.co.in

Somchai Wongwises

Department of Mechanical Engineering, Faculty of Engineering, King Mongkut's University of Technology Thonburi, Bangmod Bangkok, 10140 Thailand somchai.won@kmutt.ac.th

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the Journal of Thermal Science and Engineering Applications. Manuscript received May 20, 2018; final manuscript received April 3, 2019; published online xx xx, xxxx. Assoc. Editor: Ayyoub M. Momen.

ASME doi:10.1115/1.4043464 History: Received May 20, 2018; Accepted April 04, 2019


The thermal behaviour of a compact mini loop thermosyphon is experimentally studied at different filling ratios (20%, 30%, 40%, 50% and 70%) and tilt angles (0°, 30°, 45°, 60°, and 90°) for the heat loads of 20-300W using distilled water as the heat pipe fluid. The presence of micro fins at the evaporator results in an average decrease of 37.4% and 15.3% in thermal resistance and evaporator wall temperature respectively compared to the evaporator with plain surface. Both filling ratio (FR) and tilt angle influence the heat transfer performance significantly and the best performance of the mini loop thermosyphon is obtained at their optimum values. The thermal resistance and thermal efficiency values lie in the ranges of 0.73 - 0.076K/W and 65-88.3% for different filling ratios and tilt angles. Similarly evaporator heat transfer coefficient and evaporator wall temperature show significant variation with changes in filling ratio and tilt angle. A combination of optimum filling ratio and tilt angle shows a lowest thermal resistance of 0.076K/W and a highest evaporator wall temperature of 68.6°C which are obtained at 300W. The experimental results recommends the use of mini loop thermosyphon at optimum filling ratio for electronics cooling applications which has a heat dissipation of 20-300W.

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