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research-article

Comparative analysis between water-cooled and air-cooled heat dissipation in a high-power LED chipset

[+] Author and Article Information
Yuanlong Chen

No. 193 Tunxi Road Hefei City, Anhui Province 230009 China chenyuanlong@sina.com

Tingbo Hou

No. 193 Tunxi Road Hefei City, Anhui Province 230009 China 877717950@qq.com

Minqiang Pan

381 Wushan Road,Tianhe District Guangzhou City, Guangdong Province 510641 China 1006427@qq.com

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the Journal of Thermal Science and Engineering Applications. Manuscript received August 1, 2018; final manuscript received February 18, 2019; published online xx xx, xxxx. Assoc. Editor: Aaron P. Wemhoff.

ASME doi:10.1115/1.4043004 History: Received August 01, 2018; Accepted February 18, 2019

Abstract

With a substantial increase in thermal power density, the operating temperature of high-power LEDs rises rapidly, exerting a notable effect on chipsets' performance. A water-cooled microchannel radiator and air-cooled radiator are proposed to solve this problem. The effects of key factors of both radiators on heat dissipation in a high-power LED chipsets, and general comparisons between each method, are analyzed via Fluent. The simulation results indicate that heat dissipation from the water-cooled microchannel radiator is readily affected by the microchannel's flow rate and aspect ratio. A larger flow rate and larger aspect radio favour improved heat dissipation in the water-cooled microchannel radiator. Heat dissipation in the air-cooled radiator is related to air volume, rib number, rib height, rib thickness, and substrate thickness. A larger air volume, rib number, and rib height favour heat dissipation in the air-cooled radiator. However, there is a critical thickness value: if the thickness is less than the critical value, heat dissipation is greatly affected by rib thickness and substrate thickness, if the thickness is larger than the critical value, the influence is insignificant. The high-power LED chipsets' temperature is also related to the insulating substrate' input power and thermal conductivity. A large input power leads to a substantial increase in temperature, and larger thermal conductivity of the insulating substrate minimizes temperature increase in the high-power LED chipsets.

Copyright © 2019 by ASME
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