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Technical Brief

Enhancement of Central Processing Unit Liquid Cooling Performance Using Hexagonal Boron Nitride Nanofluids

[+] Author and Article Information
Özgür Atik

Department of Mechanical Engineering,
Boğaziçi University,
İstanbul 34342, Turkey

Hakan Ertürk

Department of Mechanical Engineering,
Boğaziçi University,
İstanbul 34342, Turkey
e-mail: hakan.erturk@boun.edu.tr

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received November 29, 2017; final manuscript received November 11, 2018; published online January 29, 2019. Assoc. Editor: Gamal Refaie-Ahmed.

J. Thermal Sci. Eng. Appl 11(3), 034501 (Jan 29, 2019) (5 pages) Paper No: TSEA-17-1462; doi: 10.1115/1.4042022 History: Received November 29, 2017; Revised November 11, 2018

Cooling performance enhancement of computer liquid cooling (LC) systems using hexagonal boron nitride (hBN)–water nanofluids is investigated experimentally. Particle volume fractions of 0.1–2% are considered at constant flow rates varying from 0.3 to 2 L/min for two different cold plates (CPs), with and without fins. A commercial closed-loop LC system is also tested to examine performance of hBN–water nanofluids at constant pumping power. It was observed that the thermal performance can be improved by using hBN nanofluids, and higher improvements are achieved for systems with limited convection rates.

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Figures

Grahic Jump Location
Fig. 3

(a) Change of Rca and Rci with particle volume fraction for the second experimental setup and (b) the change of nanofluid to base fluid Rca and St ratios

Grahic Jump Location
Fig. 2

Change of Rca and Rci with flow rate for the first experimental setup with (a) flat CP and (b) finned CP

Grahic Jump Location
Fig. 1

(a) First test setup with flow control, (b) the heater mimicking the CPU package, and (c) second test setup with commercial LC system

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