Research Papers

Computational Study and Optimization of Laminar Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling

[+] Author and Article Information
Gongnan Xie, Weihong Zhang

Engineering Simulation and Aerospace Computing (ESAC),
School of Mechnical Engineering,
Northwestern Polytechnical University,
P.O. Box 552,
710072 Xi'an, Shaanxi, China
e-mail: xgn@nwpu.edu.cn

Yanquan Liu

The Key Laboratory of Thermal Sciences and Engineering,
Xi'an Jiaotong University,
P.O. Box 1617,
710049 Xi'an, Shaanxi, China

Bengt Sunden

Division of Heat Transfer,
Department of Energy Sciences,
Lund University,
P.O.Box 118,
SE-22100 Lund, Sweden
e-mail: bengt.sunden@energy.lth.se

Manuscript received February 16, 2012; final manuscript received August 16, 2012; published online February 22, 2013. Assoc. Editor: Mehmet Arik.

J. Thermal Sci. Eng. Appl 5(1), 011004 (Feb 22, 2013) (9 pages) Paper No: TSEA-12-1029; doi: 10.1115/1.4007778 History: Received February 16, 2012; Revised August 16, 2012

The problem involved in the increase of the chip output power of high-performance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to be incorporated to manage the increase of the dissipated heat. The traditional air-cooling can not meet the requirements of cooling heat fluxes as high as 100 W/cm2, or even higher, and the traditional liquid cooling is not sufficient either in cooling very high heat fluxes although the pressure drop is small. Therefore, a new generation of liquid cooling technology becomes necessary. Various microchannels are widely used to cool the electronic chips by a gas or liquid removing the heat, but these microchannels are often designed to be single-layer channels with high pressure drop. In this paper, the laminar heat transfer and pressure loss of a kind of double-layer microchannel have been investigated numerically. The layouts of parallel-flow and counter-flow for inlet/outlet flow directions are designed and then several sets of inlet flow rates are considered. The simulations show that such a double-layer microchannel can not only reduce the pressure drop effectively but also exhibits better thermal characteristics. Due to the negative heat flux effect, the parallel-flow layout is found to be better for heat dissipation when the flow rate is limited to a low value while the counter-flow layout is better when a high flow rate can be provided. In addition, the thermal performance of the single-layer microchannel is between those of parallel-flow layout and counter-flow layout of the double-layer microchannel at low flow rates. At last, the optimizations of geometry parameters of double-layer microchannel are carried out through changing the height of the upper-branch and lower-branch channels to investigate the influence on the thermal performance.

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Majumdar, A., 2009, “Thermoelectric Devices: Helping Chips to Keep Their Cool,” Nat. Nanotechnol., 4, pp. 214–215. [CrossRef] [PubMed]
Mahajan, R., Chia-pin, C., and Chrysler, G., 2006, “Cooling a Microprocessor Chip,” Proc. IEEE, 94, pp. 1476–1486. [CrossRef]
Tuckerman, D. B., and Pease, R. F. W., 1981, “High-Performance Heat Sinking for VLSI,” IEEE Electron Device Lett., 2, pp. 126–129. [CrossRef]
Sasaki, S., and Kishimoto, T., 1986, “Optimal Structure for Microgrooved Cooling Fin for High-Power LSI Devices,” Electron. Lett., 22, pp. 1332–1334. [CrossRef]
Lee, P. S., Garimella, S. V., and Liu, D., 2005, “Investigation of Heat Transfer in Rectangular Microchannels,” Int. J. Heat Mass Transfer, 48, pp. 1688–1704. [CrossRef]
Xie, X. L., Liu, Z. J., He, Y. L., and Tao, W. Q., 2009, “Numerical Study of Laminar Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink,” Appl. Therm. Eng., 29, pp. 64–74. [CrossRef]
Xie, X. L., Tao, W. Q., and He, Y. L., 2007, “Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink,” ASME J. Electron. Packag., 129, pp. 247–255. [CrossRef]
Vafai, K., and Zhu, L., 1999, “Analysis of Two-Layered Micro-Channel Heat Sink Concept in Electronic Cooling,” Int. J. Heat Mass Transfer, 42, pp. 2287–2297. [CrossRef]
Lei, N., Ortega, A., and Vaidyanathan, R., 2007, “Modeling and Optimization of Multilayer Minichannel Heat Sinks in Single-Phase Flow,” ASME 2007 InterPACK Conference Collocated With the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference (InterPACK2007), Vol. 2, pp. 29–43. [CrossRef]
Levac, M., Soliman, H., and Ormiston, S., 2011, “Three-Dimensional Analysis of Fluid Flow and Heat Transfer in Single- and Two-Layered Micro-Channel Heat Sinks,” Heat Mass Transfer, 47, pp. 1375–1383. [CrossRef]
Wei, X., Joshi, Y., and Patterson, M. K., 2007, “Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices,” ASME J. Heat Transfer, 129, pp. 1432–1444. [CrossRef]
Joyce, G., and Soliman, H. M., 2009, “Analysis of the Transient Single-Phase Thermal Performance of Micro-Channel Heat Sinks,” Heat Transfer Eng., 30, pp. 1058–1067. [CrossRef]
Husain, A., and Kim, K.-Y., 2009, “Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section,” ASME J. Electron. Packag., 131, p. 021005. [CrossRef]
Farnam, D., Sammakia, B., Ackler, H., and Ghose, K., 2009, “Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure Constraint,” Heat Transfer Eng., 30, pp. 43–53. [CrossRef]
Wei, X., and Joshi, Y., 2004, “Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components,” ASME J. Electron. Packag., 126, pp. 60–66. [CrossRef]
Zhang, H. Y., Pinjala, D., Joshi, Y. K., Wong, T. N., and Toh, K. C., 2007, “Development and Characterization of Thermal Enhancement Structures for Single-Phase Liquid Cooling in Microelectronics Systems,” Heat Transfer Eng., 28, pp. 997–1007. [CrossRef]
Lee, P. S., Ho, J. C., and Xue, H., 2002, “Experimental Study on Laminar Heat Transfer in Microchannel Heat Sink,” ITHERM 2002, 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 379–386. [CrossRef]
Koo, J. M., and Kleinstreuer, C., 2003, “Liquid Flow in Microchannels: Experimental Observations and Computational Analyses of Microfluidics Effects,” J. Micromech. Microeng., 13, pp. 568–579. [CrossRef]
Steinke, M. E., and Kandlikar, S. G., 2004, “Review of Single-Phase Heat Transfer Enhancement Techniques for Application in Microchannels, Minichannels and Microdevices,” Int. J. Heat Technol., 22, pp. 3–11.
Tao, W. Q., He, Y. L., Wang, Q. W., Qu, Z. G., and Song, F. Q., 2002, “A Unified Analysis on Enhancing Single Phase Convective Heat Transfer With Field Synergy Principle,” Int. J. Heat Mass Transfer, 45, pp. 4871–4879. [CrossRef]
Lei, N., Skandakumaran, P., and Ortega, A., 2006, “Experiments and Modeling of Multilayer Copper Minichannel Heat Sinks in Single-Phase Flow,” 2006 Proceedings, 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, IEEE, pp. 9–18. [CrossRef]
Beh, S. L., Tio, K. K., Quadir, G. A., and Seetharamu, K. N., 2009, “Fast Transient Solution of a Two-Layered Counter-Flow Microchannel Heat Sink,” Int. J. Numer. Methods Heat Fluid Flow, 19, pp. 595–616. [CrossRef]


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Fig. 1

Double-layer microchannel heat sink

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Fig. 2

Computational domain of double-layer microchannel

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Fig. 3

Mesh independence test for single-layer microchannel

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Fig. 4

Pressure drop versus volumetric flow rate

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Fig. 5

Temperature difference versus volumetric flow rate

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Fig. 6

Relation between pressure drop and Reynolds number

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Fig. 7

Pressure drop plotted versus thermal resistance

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Fig. 8

Overall thermal resistance of different microchannels

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Fig. 9

Temperature contour map (K) of different cross sections for counter-flow configuration (left: Z = 1 mm; right: Z = 34 mm)

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Fig. 10

The contour of static temperature of double-layer microchannel (u = 0.5 m/s)

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Fig. 11

Bottom temperature distribution of double-layer microchannel along with flow direction (u = 0.5 m/s)

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Fig. 12

Overall thermal resistance versus height of lower channel (u = 0.5 m/s)

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Fig. 13

Ratio of heat dissipation versus height of lower channel (u = 0.5 m/s)



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