Topics: Deformation, Density, Elastic moduli, Fracture toughness, Hydrogen bonds, Mechanical properties, Modeling, Porosity, Tensile strength, Mechanical behavior

Topics: Atomic force microscopy, Mechanical properties, Resonance, Stress, Testing, Young's modulus, Elasticity, Nanostructures , Nanowires, Fracture (Materials)

Topics: Finite element analysis, Manufacturing, Modeling, Stress, Thermal stresses, Design, Electronics, Photonics, Bonding, Temperature

Topics: Stress, Piezoelectric ceramics, Bonding, Shear stress, Approximation, Delamination, Displacement, Elastic half space, Electromechanical systems, Failure

Topics: Composite materials, Damping, Fibers, Shear (Mechanics), Epoxy adhesives, Epoxy resins, Stress concentration, Bonding, Fiber reinforced composites, Glass

Topics: Electronic equipment, Thermal management, Cooling, Design, Heat transfer, Bonding, Databases, Flip-chip, Forced convection, Heat sinks