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Keywords: tin alloys
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Journal Articles

Experimental Investigations of an Internal Flow Generated by Porous Injection

Clarisse Fournier, Marc Michard, Françoise Bataille
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. March 2010, 77(2): 021020.
https://doi.org/10.1115/1.3197140
Published Online: December 21, 2009
... stainless steel thermometers tin alloys turbulence velocimeters blowing turbulent channel flow heat transfer particle image velocimetry cold wire thermometer The flows induced by blowing through permeable walls have been the subject of many isothermal studies due to their importance...
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Topics: Bronze, Channel flow, Flow (Dynamics), Plates (structures), Porous materials, Reynolds number, Reynolds-averaged Navier–Stokes equations, Simulation, Stainless steel, Temperature
Journal Articles

Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders

Fei Qin, Tong An, Na Chen
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2010, 77(1): 011008.
https://doi.org/10.1115/1.3168600
Published Online: September 30, 2009
... critically. solder lead-free strain rate effect constitutive model drop impact copper alloys ductility electronics packaging impact (mechanical) lead alloys reliability silver alloys solders stress-strain relations tensile strength tin alloys 22 07 2008 13 03 2009...
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Topics: Constitutive equations, Lead-free solders, Solder joints, Solders, Stress, Tensile strength, Stress-strain curves, Mechanical properties, Reliability, Ductility
Journal Articles

A Theory of Fatigue: A Physical Approach With Application to Lead-Rich Solder

S. Wen, Mem. ASME, L. M. Keer, Life Fellow ASME
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. January 2002, 69(1): 1–10.
https://doi.org/10.1115/1.1412453
Published Online: June 8, 2001
... of the paper itself in the ASME JOURNAL OF APPLIED MECHANICS . 07 March 2001 08 June 2001 lead alloys tin alloys soldering fatigue micromechanics crystal microstructure fracture mechanics microcracks percolation Solder connections in electronic packaging are expected...
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Topics: Fatigue, Solders, Microcracks