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Keywords: thermal inkjet technologyClose
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 119-127, July 6–11, 2003
Paper No: IPACK2003-35058
..., variations in heat transfer coefficients caused by uncontrolled pool boiling across devices can create thermal stresses. In this paper we demonstrate how thermal inkjet technology can be effectively utilized to spray cool a heat source with non-uniform power density. Experimental data is presented...