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Keywords: smart coolingClose
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 129-137, July 6–11, 2003
Paper No: IPACK2003-35059
... approach of cooling the entire data center to a constant temperature sampled at a single location, irrespective of the distributed utilization, is too energy inefficient. We propose a smart cooling system that provides localized cooling when and where needed and works in conjunction with a compute workload...