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Process Sensoring, Monitoring, Modeling and Verification in Electronic Packaging — Part A
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Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997
Paper No: IMECE1997-1117
DOI: https://doi.org/10.1115/IMECE1997-1117
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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding
Proceedings Papers

Prediction of the Solder Joint Configuration Under Various Geometric Parameters

Wei-Long Chen, Bor-Lin Shyu, Kuo-Ning Chiang
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 397-400, November 16–21, 1997
Paper No: IMECE1997-1116
DOI: https://doi.org/10.1115/IMECE1997-1116
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Topics: Solder joints, Shapes, Electronic packaging, Energy conservation, Gravity (Force), Numerical analysis, Shape design, Solders, Surface tension, Weight (Mass)
Proceedings Papers

Thermal Performance Evaluation of VBGA Packages

Wen C. Zheng, Paul Y. F. Wu, James J. D. Lan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 329-337, November 16–21, 1997
Paper No: IMECE1997-1107
DOI: https://doi.org/10.1115/IMECE1997-1107
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Topics: Air flow, Ball-Grid-Array packages, Engineering simulation, Finite element methods, Finite element model, Heat transfer coefficients, Modeling, Performance evaluation, Simulation, Thermal resistance
Proceedings Papers

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

Xiaohua Wu, Xinyu Dou, Chao-pin Yeh, Karl Waytt
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 391-395, November 16–21, 1997
Paper No: IMECE1997-1115
DOI: https://doi.org/10.1115/IMECE1997-1115
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Topics: Simulation, Solder joints, Geometry, Solders, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation
Proceedings Papers

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Xiantao Yan, Rakesh K. Agarwal
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 383-390, November 16–21, 1997
Paper No: IMECE1997-1114
DOI: https://doi.org/10.1115/IMECE1997-1114
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Topics: Flip-chip assemblies, Fracture toughness, Printed circuit boards, Stress, Fracture (Materials), Silicon chips, Solder masks
Proceedings Papers

Applications of Digital Correlation Method to Microscopic Strain Measurement and Materials’ Property Characterization

H. Lu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 423-428, November 16–21, 1997
Paper No: IMECE1997-1119
DOI: https://doi.org/10.1115/IMECE1997-1119
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Topics: Hardware, Manufacturing, Reliability, Resolution (Optics), Strain measurement
Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997
Paper No: IMECE1997-1118
DOI: https://doi.org/10.1115/IMECE1997-1118
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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density
Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997
Paper No: IMECE1997-1109
DOI: https://doi.org/10.1115/IMECE1997-1109
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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding
Proceedings Papers

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Tien-Yu Tom Lee, Ravi Sharma, André Peyre-Lavigne
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 339-345, November 16–21, 1997
Paper No: IMECE1997-1108
DOI: https://doi.org/10.1115/IMECE1997-1108
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Topics: Carbon monoxide, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption
Proceedings Papers

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Zhengfang Qian, Minfu Lu, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 377-382, November 16–21, 1997
Paper No: IMECE1997-1113
DOI: https://doi.org/10.1115/IMECE1997-1113
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Topics: Modeling, Polymer films, Viscoelasticity, Viscoplasticity, Deformation, Stress, Chain, Constitutive equations, Drag (Fluid dynamics), Temperature effects
Proceedings Papers

Wafer Surface Measurements Using Shadow Moiré With Talbot Effect

S. Wu, S. Wei, I. Kao, F. P. Chiang
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 369-376, November 16–21, 1997
Paper No: IMECE1997-1112
DOI: https://doi.org/10.1115/IMECE1997-1112
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Topics: Semiconductor wafers, Shades and shadows
Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997
Paper No: IMECE1997-1111
DOI: https://doi.org/10.1115/IMECE1997-1111
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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings
Proceedings Papers

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

Hsien-Chie Cheng, Kuo-Ning Chiang, Ming-Hsiao Lee
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 353-360, November 16–21, 1997
Paper No: IMECE1997-1110
DOI: https://doi.org/10.1115/IMECE1997-1110
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Topics: Ball-Grid-Array packaging, Finite element analysis, Optimization, Packaging, Pipes, Plastics, Solder joints