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Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997
Paper No: IMECE1997-1118
DOI: https://doi.org/10.1115/IMECE1997-1118
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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density
Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997
Paper No: IMECE1997-1109
DOI: https://doi.org/10.1115/IMECE1997-1109
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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding
Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997
Paper No: IMECE1997-1227
DOI: https://doi.org/10.1115/IMECE1997-1227
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Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation
Proceedings Papers

Velocity Profiles Through and Over Arrays of Impermeable Cylinders

B. Bijeljic, A. G. Sederman, M. D. Mantle, L. F. Gladden, T. D. Papathanasiou
Proc. ASME. IMECE97, Rheology and Fluid Mechanics of Nonlinear Materials, 15-20, November 16–21, 1997
Paper No: IMECE1997-0469
DOI: https://doi.org/10.1115/IMECE1997-0469
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Topics: Cylinders, Flow (Dynamics), Open channels (Hydraulics), Boundary element methods, Magnetic resonance imaging, Composite materials, Design, Fluids, Molding, Preforms
Proceedings Papers

Vibration-Assisted Liquid Composite Molding: Practical and Numerical Simulation

Emmanuel O. Ayorinde, Ronald F. Gibson, Feihua Deng, Bakhtiar Baig
Proc. ASME. IMECE97, Rheology and Fluid Mechanics of Nonlinear Materials, 177-183, November 16–21, 1997
Paper No: IMECE1997-0485
DOI: https://doi.org/10.1115/IMECE1997-0485
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Topics: Composite materials, Computer simulation, Molding, Vibration, Damping, Finite element analysis, Fluids, Preforms, Resins, Water
Proceedings Papers

Numerical Prediction of the Molding of Composite Parts

F. Dupret, V. Verleye, B. Languillier
Proc. ASME. IMECE97, Rheology and Fluid Mechanics of Nonlinear Materials, 79-90, November 16–21, 1997
Paper No: IMECE1997-0476
DOI: https://doi.org/10.1115/IMECE1997-0476
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Topics: Approximation, Composite materials, Fibers, Flow (Dynamics), Molding, Numerical analysis
Proceedings Papers

Nondestructive Elastic Property Characterization of IC Encapsulants

Sridhar Canumalla, Michael G. Oravecz
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 25-32, November 16–21, 1997
Paper No: IMECE1997-0496
DOI: https://doi.org/10.1115/IMECE1997-0496
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Topics: Delamination, Elasticity, Fillers (Materials), Flip-chip packages, Integrated circuit packaging, Molding, Process control, Reliability, Resins, Young's modulus
Proceedings Papers

3-D Numerical Simulation of Blow Moulding Technology Involving Sequential Coextrusion

Benoît Debbaut
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 389-398, November 16–21, 1997
Paper No: IMECE1997-0643
DOI: https://doi.org/10.1115/IMECE1997-0643
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Topics: Computer simulation, Molding, Algorithms, Containers, Deformation, Fluids, Membranes, Simulation, Wall thickness
Proceedings Papers

An Implementation of Concurrent Engineering Concept to Injection Molding

K. K. Wang
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 1-14, November 16–21, 1997
Paper No: IMECE1997-0616
DOI: https://doi.org/10.1115/IMECE1997-0616
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Topics: Concurrent engineering, Injection molding, Design, Manufacturing, Molding, Optimization, Process control, Shapes
Proceedings Papers

Numerical Simulation of Injection/Compression Molding

T. James Wang
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 83-96, November 16–21, 1997
Paper No: IMECE1997-0621
DOI: https://doi.org/10.1115/IMECE1997-0621
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Topics: Compression molding, Computer simulation, Injection molding, Cavities, Molding, Packing (Shipments), Packings (Cushioning), Pressure, Stress, Compression
Proceedings Papers

Finite Element Prediction of Sink Marks in Injection Molded Plastic Parts

David J. Battey, Mahesh Gupta
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 335-350, November 16–21, 1997
Paper No: IMECE1997-0639
DOI: https://doi.org/10.1115/IMECE1997-0639
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Topics: Finite element analysis, Injection molded plastics, Computer software, Molding
Proceedings Papers

Sensor/Model Fusion for Improved Process Understanding and Control in Injection Molding

Li-Jen Chien, Charles L. Thomas, Del R. Lawson
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 189-197, November 16–21, 1997
Paper No: IMECE1997-0629
DOI: https://doi.org/10.1115/IMECE1997-0629
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Topics: Injection molding, Sensors, Molding, Pressure sensors, Ultrasonic transducers, Cavities, Machinery, Polymers, Signals, Temperature
Proceedings Papers

Modeling Race Tracking Effects in Liquid Composite Molding

Albert W. Chan, Roger J. Morgan
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 361-367, November 16–21, 1997
Paper No: IMECE1997-0641
DOI: https://doi.org/10.1115/IMECE1997-0641
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Topics: Composite materials, Modeling, Molding, Flow (Dynamics), Preforms, Resins, Clearances (Engineering), Manufacturing, Automotive industry, Cavities
Proceedings Papers

Integrated Simulations of Structural Performance, Molding Process and Warpage for Gas-Assisted Injection Molded Parts

Shia-Chung Chen, Nien-Tien Cheng, Sheng-Yan Hu
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 15-32, November 16–21, 1997
Paper No: IMECE1997-0617
DOI: https://doi.org/10.1115/IMECE1997-0617
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Topics: Engineering simulation, Molding, Simulation, Warping, Geometry, Algorithms, Boundary element methods, Computer-aided engineering, Cooling, Cycles
Proceedings Papers

Smart Processing of Plastics Through Vibration Controlled Shear-Thinning and Orientation

J. P. Ibar
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 223-248, November 16–21, 1997
Paper No: IMECE1997-0632
DOI: https://doi.org/10.1115/IMECE1997-0632
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Topics: Plastics, Shear (Mechanics), Vibration, Viscosity, Cooling, Extruding, Injection molding, Molding, Oscillating frequencies, Plastics molding
Proceedings Papers

The Influence of Processing on Structural Behaviour: An Interface Between Moldflow and ABAQUS

Wim Bruijs, Rob Brounné
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 97-106, November 16–21, 1997
Paper No: IMECE1997-0622
DOI: https://doi.org/10.1115/IMECE1997-0622
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Topics: Accounting, Computer-aided engineering, Cycles, Design, Finite element analysis, Geometry, Injection molding, Jigs and fixtures, Molding, Shapes
Proceedings Papers

Rotational Molding of Low-Density LLDPE Foams

Guobin Liu, Chul B. Park, John A. Lefas
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 33-49, November 16–21, 1997
Paper No: IMECE1997-0618
DOI: https://doi.org/10.1115/IMECE1997-0618
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Topics: Density, Foams (Chemistry), Linear low density polyethylene, Molding, Dynamics (Mechanics), Elasticity, Heating, Nucleation (Physics), Optical microscopes, Plastic foam
Proceedings Papers

Optimization of the Compression (Injection/Compression) Molding Process Using Numerical Simulation

Bruce A. Davis, Richard P. Theriault, Tim A. Osswald
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 125-138, November 16–21, 1997
Paper No: IMECE1997-0624
DOI: https://doi.org/10.1115/IMECE1997-0624
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Topics: Compression, Computer simulation, Molding, Optimization, Design, Simulation, Computers, Fibers, Thermosetting composites, Vehicles
Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997
Paper No: IMECE1997-0818
DOI: https://doi.org/10.1115/IMECE1997-0818
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Paper No: IMECE1997-0819
DOI: https://doi.org/10.1115/IMECE1997-0819
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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability