Search Results | IMECE | ASME Digital Collection

1-20 of 1136

2 3 4 5

Sort by

Sort Order Select

Proceedings Papers

Role of Unloading in Machining of Brittle Materials

A. Chandra, K. Wang, Y. Huang, G. Subhash

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 83-90, November 16–21, 1997

Paper No: IMECE1997-1139

DOI: https://doi.org/10.1115/IMECE1997-1139

View Paper

Topics: Borosilicate glasses, Brittleness, Ceramics, Damage, Design, Fracture (Materials), Fracture (Process), Glass, Grinding, Machining

Proceedings Papers

Chip Formation When Hard Turning Steel

Amitabh Vyas, Milton C. Shaw

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 21-28, November 16–21, 1997

Paper No: IMECE1997-1131

DOI: https://doi.org/10.1115/IMECE1997-1131

View Paper

Topics: Steel, Turning, Machining, Grinding, Boron, Ceramics, Finishes, Fracture (Materials), Fracture (Process), Hard materials

Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997

Paper No: IMECE1997-1121

DOI: https://doi.org/10.1115/IMECE1997-1121

View Paper

Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries

Proceedings Papers

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Xiantao Yan, Rakesh K. Agarwal

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 383-390, November 16–21, 1997

Paper No: IMECE1997-1114

DOI: https://doi.org/10.1115/IMECE1997-1114

View Paper

Topics: Flip-chip assemblies, Fracture toughness, Printed circuit boards, Stress, Fracture (Materials), Silicon chips, Solder masks

Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997

Paper No: IMECE1997-1118

DOI: https://doi.org/10.1115/IMECE1997-1118

View Paper

Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density

Proceedings Papers

Development of a Magnetostrictive Torque Sensor for Milling Process Monitoring

Hiro Ohzeki, Akihiro Mashine, Hideki Aoyama, Ichiro Inasaki

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 129-136, November 16–21, 1997

Paper No: IMECE1997-1085

DOI: https://doi.org/10.1115/IMECE1997-1085

View Paper

Topics: Milling, Process monitoring, Sensors, Torque, Cutting, Alloys, Failure, Fracture (Materials), Fracture (Process), Permeability

Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997

Paper No: IMECE1997-1109

DOI: https://doi.org/10.1115/IMECE1997-1109

View Paper

Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding

Proceedings Papers

Microstructural Effects on the Machining Performance of Dental Ceramics

D. T. Le, Lixun Qi, Guangming Zhang, Stanley J. Ng

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 245-251, November 16–21, 1997

Paper No: IMECE1997-1098

DOI: https://doi.org/10.1115/IMECE1997-1098

View Paper

Topics: Ceramics, Machining, Bending strength, Chemical properties, Cutting, Force measurement, Fracture (Materials), Fracture (Process), Fracture toughness, Microscale devices

Proceedings Papers

Load Interaction Effects in Coupon Fatigue Tests Using a Railroad Tank Car Spectrum

Peter C. McKeighan, Keith B. Smith, Joseph W. Cardinal

Proc. ASME. IMECE97, Rail Transportation, 33-41, November 16–21, 1997

Paper No: IMECE1997-0591

DOI: https://doi.org/10.1115/IMECE1997-0591

View Paper

Topics: Fatigue testing, Railway tank cars, Stress, Fracture (Materials), Peak load, Damage, Roads

Proceedings Papers

Experimental and Numerical Analysis of Ceramics With Microcracking

Gang Yin, Ling Xu, Lin Jiang

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 463-468, November 16–21, 1997

Paper No: IMECE1997-0702

DOI: https://doi.org/10.1115/IMECE1997-0702

View Paper

Topics: Ceramics, Numerical analysis, Fracture (Materials), Fracture (Process), Simulation, Damage, Damage mechanics, Finite element analysis, Microcracks, Structures

Proceedings Papers

Process Zone of Polycrystalline Alumina

D. K. Tran, A. S. Kobayashi, K. W. White

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 361-364, November 16–21, 1997

Paper No: IMECE1997-0684

DOI: https://doi.org/10.1115/IMECE1997-0684

View Paper

Topics: Cantilever beams, Ceramic composites, Ceramics, Density, Fibers, Fracture (Materials), Fracture toughness

Proceedings Papers

Stress Redistribution and Notch Sensitivity in Ceramic Matrix Composites (CMCs)

Thomas J. Mackin, Mark C. Roberts, David Anderson

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 357-360, November 16–21, 1997

Paper No: IMECE1997-0683

DOI: https://doi.org/10.1115/IMECE1997-0683

View Paper

Topics: Ceramic matrix composites, Stress, Damage, Fibers, Failure, Fracture (Materials), Ceramic composites, Composite materials, Cracking (Materials), Fracture (Process)

Proceedings Papers

Crack Initiation in Notched Unidirectional Graphite/Epoxy Composites

C. L. Chow, Fan Yang, H. Eliot Fang

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 223-233, November 16–21, 1997

Paper No: IMECE1997-0668

DOI: https://doi.org/10.1115/IMECE1997-0668

View Paper

Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fracture (Materials), Graphite, Damage, Failure, Fibers, Constitutive equations, Anisotropy

Proceedings Papers

An Investigation of Crack/Microstructure Interaction in a Layered Intermetallic Composite

Rong Wang, Fan Ye, Noriko Katsube, Wole Soboyejo

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 241-249, November 16–21, 1997

Paper No: IMECE1997-0670

DOI: https://doi.org/10.1115/IMECE1997-0670

View Paper

Topics: Composite materials, Fracture (Materials), Intermetallic compounds, Damage, Finite element model, Micromechanics (Engineering)

Proceedings Papers

Self-Healing Composites Using Embedded Microspheres

D. Jung, A. Hegeman, N. R. Sottos, P. H. Geubelle, S. R. White

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 265-275, November 16–21, 1997

Paper No: IMECE1997-0673

DOI: https://doi.org/10.1115/IMECE1997-0673

View Paper

Topics: Composite materials, Fracture (Materials), Maintenance, Fracture toughness, Polyester fabrics, Adhesion, Cantilever beams, Elastic moduli, Molecular weight, Resins

Proceedings Papers

Automating the Design Process and Powder Processing of Functionally Gradient Materials

Patrick Kwon, Melissa Crimp, Moon Jung Chung

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 73-88, November 16–21, 1997

Paper No: IMECE1997-0653

DOI: https://doi.org/10.1115/IMECE1997-0653

View Paper

Topics: Design, Composite materials, Manufacturing, Cylinders, Fracture (Materials), Geometry, Process management (Business automation), Residual stresses, Shrinkage (Materials)

Proceedings Papers

Effect of Creep Feed Grinding Parameters on Strength and Finish of Alumina

G. Sathyanarayanan, Louis J. Plebani, Hsueh-Ming S. Wang

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 411-415, November 16–21, 1997

Paper No: IMECE1997-0694

DOI: https://doi.org/10.1115/IMECE1997-0694

View Paper

Topics: Creep, Finishes, Grinding, Bending strength, Stress, Ceramics, Design, Fracture (Materials), Reliability, Surface roughness

Proceedings Papers

Process Modeling and Interfacial Behavior in the VSPA Package

Richard Harries, Suresh Sitaraman

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 293-299, November 16–21, 1997

Paper No: IMECE1997-0676

DOI: https://doi.org/10.1115/IMECE1997-0676

View Paper

Topics: Delamination, Electronic packages, Failure mechanisms, Finite element model, Fracture (Materials), Fracture mechanics, Geometry, Manufacturing, Materials properties, Modeling

Proceedings Papers

Direct Observation of Contact Damage Produced by Vickers Indentation in Diamond-Like Films

Vispi Homi Bulsara, Srinivasan Chandrasekar, Thomas N. Farris

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 287-292, November 16–21, 1997

Paper No: IMECE1997-0675

DOI: https://doi.org/10.1115/IMECE1997-0675

View Paper

Topics: Damage, Diamond films, Stress, Delamination, Adhesives, Cracking (Materials), Failure, Force sensors, Fracture (Materials), Fracture (Process)

Proceedings Papers

Effects of Stress Concentrations at the Slipping Fiber/Matrix Interface on Tensile Strength of Ceramic Matrix Composites

B. K. Ahn, W. A. Curtin

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 373, November 16–21, 1997

Paper No: IMECE1997-0686

DOI: https://doi.org/10.1115/IMECE1997-0686

View Paper

Topics: Ceramic matrix composites, Fibers, Stress, Tensile strength, Composite materials, Fracture (Materials), Brittleness, Fracture toughness, Approximation, Damage

2 3 4 5

NARROW

Role of Unloading in Machining of Brittle Materials

Chip Formation When Hard Turning Steel

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Development of a Magnetostrictive Torque Sensor for Milling Process Monitoring

Investigation of the Lead-On-Chip Package’s Reliability

Microstructural Effects on the Machining Performance of Dental Ceramics

Load Interaction Effects in Coupon Fatigue Tests Using a Railroad Tank Car Spectrum

Experimental and Numerical Analysis of Ceramics With Microcracking

Process Zone of Polycrystalline Alumina

Stress Redistribution and Notch Sensitivity in Ceramic Matrix Composites (CMCs)

Crack Initiation in Notched Unidirectional Graphite/Epoxy Composites

An Investigation of Crack/Microstructure Interaction in a Layered Intermetallic Composite

Self-Healing Composites Using Embedded Microspheres

Automating the Design Process and Powder Processing of Functionally Gradient Materials

Effect of Creep Feed Grinding Parameters on Strength and Finish of Alumina

Process Modeling and Interfacial Behavior in the VSPA Package

Direct Observation of Contact Damage Produced by Vickers Indentation in Diamond-Like Films

Effects of Stress Concentrations at the Slipping Fiber/Matrix Interface on Tensile Strength of Ceramic Matrix Composites

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only