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Proceedings Papers

Role of Unloading in Machining of Brittle Materials

A. Chandra, K. Wang, Y. Huang, G. Subhash

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 83-90, November 16–21, 1997

Paper No: IMECE1997-1139

DOI: https://doi.org/10.1115/IMECE1997-1139

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Topics: Borosilicate glasses, Brittleness, Ceramics, Damage, Design, Fracture (Materials), Fracture (Process), Glass, Grinding, Machining

Proceedings Papers

Chip Formation When Hard Turning Steel

Amitabh Vyas, Milton C. Shaw

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 21-28, November 16–21, 1997

Paper No: IMECE1997-1131

DOI: https://doi.org/10.1115/IMECE1997-1131

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Topics: Steel, Turning, Machining, Grinding, Boron, Ceramics, Finishes, Fracture (Materials), Fracture (Process), Hard materials

Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997

Paper No: IMECE1997-1121

DOI: https://doi.org/10.1115/IMECE1997-1121

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Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries

Proceedings Papers

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Xiantao Yan, Rakesh K. Agarwal

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 383-390, November 16–21, 1997

Paper No: IMECE1997-1114

DOI: https://doi.org/10.1115/IMECE1997-1114

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Topics: Flip-chip assemblies, Fracture toughness, Printed circuit boards, Stress, Fracture (Materials), Silicon chips, Solder masks

Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997

Paper No: IMECE1997-1118

DOI: https://doi.org/10.1115/IMECE1997-1118

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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density

Proceedings Papers

Development of a Magnetostrictive Torque Sensor for Milling Process Monitoring

Hiro Ohzeki, Akihiro Mashine, Hideki Aoyama, Ichiro Inasaki

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 129-136, November 16–21, 1997

Paper No: IMECE1997-1085

DOI: https://doi.org/10.1115/IMECE1997-1085

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Topics: Milling, Process monitoring, Sensors, Torque, Cutting, Alloys, Failure, Fracture (Materials), Fracture (Process), Permeability

Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997

Paper No: IMECE1997-1109

DOI: https://doi.org/10.1115/IMECE1997-1109

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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding

Proceedings Papers

Microstructural Effects on the Machining Performance of Dental Ceramics

D. T. Le, Lixun Qi, Guangming Zhang, Stanley J. Ng

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 245-251, November 16–21, 1997

Paper No: IMECE1997-1098

DOI: https://doi.org/10.1115/IMECE1997-1098

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Topics: Ceramics, Machining, Bending strength, Chemical properties, Cutting, Force measurement, Fracture (Materials), Fracture (Process), Fracture toughness, Microscale devices

Proceedings Papers

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

H. V. Tippur, H. Krishnamoorthy

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 77-84, November 16–21, 1997

Paper No: IMECE1997-1230

DOI: https://doi.org/10.1115/IMECE1997-1230

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Topics: Copper, Displacement, Fracture (Materials), Solders, Deformation, Fracture toughness, Interferometry, Strain gages

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

I. Mohammed, K. M. Liechti

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 91-95, November 16–21, 1997

Paper No: IMECE1997-1232

DOI: https://doi.org/10.1115/IMECE1997-1232

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Topics: Corners (Structural elements), Fracture (Materials), Nucleation (Physics), Eigenvalues, Stress, Elasticity, Geometry, Microelectronic devices, Structural elements (Construction)

Proceedings Papers

Advances in Tensile Testing of Polysilicon Thin Films

William N. Sharpe, Jr., Bin Yuan, Richard L. Edwards

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 113-116, November 16–21, 1997

Paper No: IMECE1997-1235

DOI: https://doi.org/10.1115/IMECE1997-1235

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Topics: Polysilicon, Tensile testing, Thin films, Testing, ASTM International, Mechanical properties, Displacement, Fracture (Materials), Fracture toughness, Mechanical testing

Proceedings Papers

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

A. Shirani, K. M. Liechti, F. J. Boerio

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 131-133, November 16–21, 1997

Paper No: IMECE1997-1238

DOI: https://doi.org/10.1115/IMECE1997-1238

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Topics: Fracture (Materials), Fracture (Process), Metals, Adhesives, Aluminum, Modeling

Proceedings Papers

Failure Mechanism of a Thermocouple Well Caused by Flow-Induced Vibration: (2) — Interaction Between Flow-Induced Vibration and Fatigue Crack Growth in a Thermocouple Well

Yusaku Wada, Masaki Morishita, Akira Yamaguchi, Koji Iwata, Masakazu Ichimiya

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume I, 149-157, November 16–21, 1997

Paper No: IMECE1997-0054

DOI: https://doi.org/10.1115/IMECE1997-0054

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Topics: Failure mechanisms, Fatigue cracks, Flow-induced vibrations, Thermocouples, Fracture (Materials), Displacement, Failure, Damping, Fatigue, High cycle fatigue

Proceedings Papers

A Biomechanical Comparison Between Modern Anterior Versus Posterior Plate Fixation of Unstable Cervical Spine Injuries

Tae-Hong Lim, Howard S. An, Young Do Koh, Linda M. McGrady

Proc. ASME. IMECE97, Advances in Bioengineering, 217-218, November 16–21, 1997

Paper No: IMECE1997-0306

DOI: https://doi.org/10.1115/IMECE1997-0306

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Topics: Biomechanics, Cervical spine, Wounds, Plating, Fracture (Materials), Fracture (Process), Screws, Stability, Stiffness, Surgery

Proceedings Papers

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Jinbao Jiao, Charan K. Gurumurthy, Edward J. Kramer, Yan Sha, Chung-Yuen Hui, Peter Børgesen

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 97-102, November 16–21, 1997

Paper No: IMECE1997-0504

DOI: https://doi.org/10.1115/IMECE1997-0504

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Topics: Adhesion, Cantilever beams, Stress, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Ethers (Class of compounds), Thermal expansion

Proceedings Papers

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Jianjun Wang, Minfu Lu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 103-113, November 16–21, 1997

Paper No: IMECE1997-0505

DOI: https://doi.org/10.1115/IMECE1997-0505

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Topics: Flip-chip packages, Fracture (Materials), Stress, Crack propagation, Fracture toughness, Silicon chips, Deflection, Displacement, Interferometry, Density

Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997

Paper No: IMECE1997-0493

DOI: https://doi.org/10.1115/IMECE1997-0493

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Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams

Proceedings Papers

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997

Paper No: IMECE1997-0513

DOI: https://doi.org/10.1115/IMECE1997-0513

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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics

Proceedings Papers

Die Strength Evaluation in the Presence of Edge Cracks

Betty Leung, Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 125-131, November 16–21, 1997

Paper No: IMECE1997-0507

DOI: https://doi.org/10.1115/IMECE1997-0507

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Topics: Fracture (Materials), Reliability, Stress, Testing, Failure analysis, Finite element analysis, Manufacturing, Silicon

2 3 4 5

NARROW

Role of Unloading in Machining of Brittle Materials

Chip Formation When Hard Turning Steel

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Development of a Magnetostrictive Torque Sensor for Milling Process Monitoring

Investigation of the Lead-On-Chip Package’s Reliability

Microstructural Effects on the Machining Performance of Dental Ceramics

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

Advances in Tensile Testing of Polysilicon Thin Films

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

Failure Mechanism of a Thermocouple Well Caused by Flow-Induced Vibration: (2) — Interaction Between Flow-Induced Vibration and Fatigue Crack Growth in a Thermocouple Well

A Biomechanical Comparison Between Modern Anterior Versus Posterior Plate Fixation of Unstable Cervical Spine Injuries

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

The Effect of Temperature and Humidity Exposure on Adhesion

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Die Strength Evaluation in the Presence of Edge Cracks

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