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Proceedings Papers

Transient Thermal Analysis of Outdoor Electronic Equipment

L. T. Yeh
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 65-73, November 16–21, 1997
Paper No: IMECE1997-1215
DOI: https://doi.org/10.1115/IMECE1997-1215
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Topics: Electronic equipment, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Electronic components, Flow (Dynamics), Junctions, Reliability
Proceedings Papers

Characterization of Electric Fan Noise Generation Due to Blade Geometry

Liliosa-Eyang Cole, Fred Barez
Proc. ASME. IMECE2021, Volume 1: Acoustics, Vibration, and Phononics, V001T01A001, November 1–5, 2021
Paper No: IMECE2021-68201
DOI: https://doi.org/10.1115/IMECE2021-68201
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Topics: Blades, Geometry, Noise (Sound), Sound pressure, Flow (Dynamics), Noise control, Pressure, Rotors, Aerodynamic noise, Computational fluid dynamics
Proceedings Papers

Instability and Heat Transfer in Mixed Convection Flow in a Horizontal Duct With Discrete Heat Sources

Qinghua Wang, Yogesh Jaluria
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 13-25, November 11–16, 2001
Paper No: IMECE2001/HTD-24373
DOI: https://doi.org/10.1115/IMECE2001/HTD-24373
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Topics: Ducts, Flow (Dynamics), Heat, Heat transfer, Mixed convection, Cooling, Electronic equipment, Modeling, Reynolds number, Strips
Proceedings Papers

Performance Evaluation of Serrated Plate Fins for Under-Carriage Electronics Cooling in Transportation Application

Ibraheem K. Shwaish, Jayathi Y. Murthy, Cristina H. Amon, Diep Bains
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 177-178, November 11–16, 2001
Paper No: IMECE2001/HTD-24391
DOI: https://doi.org/10.1115/IMECE2001/HTD-24391
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Topics: Computer cooling, Fins, Performance evaluation, Railroad passenger cars, Transportation systems, Cooling, Electronics, Heat sinks, Flow (Dynamics), Trains
Proceedings Papers

Studies on Natural Convection Induced Flow and Thermal Behavior Inside Electronic Equipment Cabinet Model

Masaru Ishizuka, Guoyi Peng, Shinji Hayama
Proc. ASME. IMECE2001, Heat Transfer: Volume 5 — Computational, Aerospace and Environmental Heat Transfer, 171-176, November 11–16, 2001
Paper No: IMECE2001/HTD-24299
DOI: https://doi.org/10.1115/IMECE2001/HTD-24299
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Topics: Electronic equipment, Flow (Dynamics), Heat flux, Natural convection
Proceedings Papers

State of the Art Demanufacturing of Electronic Equipment for Reuse and Recycling (DEER2)

Nelson Colon, Laura Battista, Glenn Kuntz, Woody Allen
Proc. ASME. IMECE2000, Successfully Managing the Risk and Development of Your Business and Technology, 83, November 5–10, 2000
Paper No: IMECE2000-1185
DOI: https://doi.org/10.1115/IMECE2000-1185
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Topics: Electronic equipment, Recycling, Defense industry, Sanitary landfills, Computers, US Department of Defense, Decontamination, Glass, Hazards, Innovation
Proceedings Papers

Mitigating Environmental and Occupational Health Concerns for the Electronic Demanufacturing Industry

LuAnn Gibson
Proc. ASME. IMECE2000, Successfully Managing the Risk and Development of Your Business and Technology, 85, November 5–10, 2000
Paper No: IMECE2000-1186
DOI: https://doi.org/10.1115/IMECE2000-1186
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Topics: Occupational safety and health, Electronics, Computers, Cutting, Electronic components, Electronic equipment, Ergonomics, Errors, Forklifts, Hazardous substances
Proceedings Papers

Florida’s Strategy for the Management of End-of-Life Computers, CRTs and Other Electronic Equipment

Raoul Clark
Proc. ASME. IMECE2000, Successfully Managing the Risk and Development of Your Business and Technology, 87, November 5–10, 2000
Paper No: IMECE2000-1187
DOI: https://doi.org/10.1115/IMECE2000-1187
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Topics: Computers, Electronic equipment, Recycling, Sanitary landfills, Cathode rays, Electronics, Hazardous wastes
Proceedings Papers

Investigation on Thermal Performance of a Simple Electronic Board Using Different Phase Change Material Packaging Types

Emir Özkökdemir, Yener Usul
Proc. ASME. IMECE2020, Volume 11: Heat Transfer and Thermal Engineering, V011T11A005, November 16–19, 2020
Paper No: IMECE2020-23729
DOI: https://doi.org/10.1115/IMECE2020-23729
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Topics: Cooling, Finite element methods, Packaging, Phase change materials, Electronics, Energy storage, Heating, Aluminum, Computation, Computational methods
Proceedings Papers

Mechanical Stress Monitoring Sensor for 3-D Module During Manufacturing and Operation

Koki Isobe, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2017, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A015, November 3–9, 2017
Paper No: IMECE2017-70323
DOI: https://doi.org/10.1115/IMECE2017-70323
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Topics: Manufacturing, Sensors, Stress, Mechanical properties, Silicon chips, Electronic equipment, Packaging, Reliability, Silicon, Stress concentration
Proceedings Papers

Design Considerations Relating to Non-Thermal Aspects of Oil Immersion Cooling

Jimil M. Shah, Syed Haider I. Rizvi, Indu Sravani Kota, Sahithi Reddy Nagilla, Dhaval Thakkar, Dereje Agonafer
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A054, November 11–17, 2016
Paper No: IMECE2016-67320
DOI: https://doi.org/10.1115/IMECE2016-67320
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Topics: Cooling, Design, Data centers, Mineral oil, Oils, Petroleum, Fluids, Hazards, Maintainability, Safety
Proceedings Papers

Collapsible Wind Powered Energy Generation and Storage Device

Justin R. Chambers, Andrew D. Lowery, James E. Smith
Proc. ASME. IMECE2015, Volume 14: Emerging Technologies; Safety Engineering and Risk Analysis; Materials: Genetics to Structures, V014T06A002, November 13–19, 2015
Paper No: IMECE2015-51816
DOI: https://doi.org/10.1115/IMECE2015-51816
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Topics: Energy generation, Storage, Wind, Wind turbines, Emergencies, Weight (Mass), Batteries, Battery life, Design, Electronic equipment
Proceedings Papers

Numerical and Experimental Investigation on Thermal Management of an Outdoor Battery Cabinet

X. Z. Meng, Z. Lu, L. J. Su, X. L. Luo, L. C. Wei, L. W. Jin, J. Chai
Proc. ASME. IMECE2014, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A057, November 14–20, 2014
Paper No: IMECE2014-38229
DOI: https://doi.org/10.1115/IMECE2014-38229
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Topics: Batteries, Thermal management, Temperature, Computational fluid dynamics, Electronic equipment, Flow (Dynamics), Solar radiation, Temperature distribution, Computer simulation, Construction
Proceedings Papers

Impedance Effects During High-Frequency Dielectrophoresis

Hanieh Hadady, Kelsey A. Michael, Emil J. Geiger
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A046, November 14–20, 2014
Paper No: IMECE2014-38435
DOI: https://doi.org/10.1115/IMECE2014-38435
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Topics: Dielectrophoresis, Electric fields, Generators, Oscilloscopes, Signals, Electrodes, Stress, Waves, Copper, Electrical measurement
Proceedings Papers

Optimum Spacing of Vertical Parallel Plates for Maximum Radiation Heat Transfer

Hanry Issavi, Fred Barez, Younes Shabany, Ernest Thurlow
Proc. ASME. IMECE2014, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A062, November 14–20, 2014
Paper No: IMECE2014-36388
DOI: https://doi.org/10.1115/IMECE2014-36388
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Topics: Heat transfer, Plates (structures), Radiation (Physics), Heat, Convection, Cooling, Electromechanical systems, Electronic equipment, Emissivity, Energy dissipation
Proceedings Papers

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

Kenji Hirohata, Yousuke Hisakuni, Takahiro Omori, Tomoko Monda, Minoru Mukai
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A082, November 15–21, 2013
Paper No: IMECE2013-65317
DOI: https://doi.org/10.1115/IMECE2013-65317
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Topics: Circuits, Fatigue failure, Printed circuit boards, Solder joints, Ball-Grid-Array packaging, Stress, Density, Failure, Packaging, Probability
Proceedings Papers

Integration of Carbon Nanotubes Into a Fiberglass Reinforced Polymer Composite and its Effects on Electromagnetic Shielding and Mechanical Properties

Mehran Tehrani, Ayoub Y. Boroujeni, Majid Manteghi, Zhixian Zhou, Marwan Al-Haik
Proc. ASME. IMECE2013, Volume 9: Mechanics of Solids, Structures and Fluids, V009T10A024, November 15–21, 2013
Paper No: IMECE2013-65202
DOI: https://doi.org/10.1115/IMECE2013-65202
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Topics: Carbon nanotubes, Glass reinforced plastics, Mechanical properties, Polymer composites, Composite materials, Textiles, Coated fabrics, Electrical conductivity, Electromagnetic interference, Manufacturing
Proceedings Papers

Convective Heat Transfer Enhancement With Micro Pin-Fin Surfaces Cooled by a Piezoelectrically-Driven Translational Agitator

Taiho Yeom, Terrence W. Simon, Tao Zhang, Mark T. North, Tianhong Cui
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 685-691, November 9–15, 2012
Paper No: IMECE2012-88428
DOI: https://doi.org/10.1115/IMECE2012-88428
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Topics: Convection, Cooling, Displacement, Heat transfer, Channel flow, Fins, Flow (Dynamics), Actuators, Copper, Electronic equipment
Proceedings Papers

Comparison Between PIV Results and CFD Simulations of Air Flows in a Thin Electronics Casing Model

Masaru Ishizuka, Tomoyuki Hatakeyama, Risako Kibushi, Yasushi Nishino, Shinji Nakagawa
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1405-1410, November 9–15, 2012
Paper No: IMECE2012-85581
DOI: https://doi.org/10.1115/IMECE2012-85581
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Topics: Air flow, Computational fluid dynamics, Electronics, Engineering simulation, Simulation, Electronic equipment, Flow (Dynamics), Cooling, Heat, Particulate matter
Proceedings Papers

Capitalizing on the Lock-On Phenomenon in the Cooling of Electronic Equipment

Raed I. Bourisli
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1419-1425, November 9–15, 2012
Paper No: IMECE2012-86105
DOI: https://doi.org/10.1115/IMECE2012-86105
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Topics: Cooling, Electronic equipment, Locks (Waterways), Oscillations, Plates (structures), Fluids, Flow (Dynamics), Heat, Vortex shedding, Corners (Structural elements)