Electronic packages are complicated material systems operating under thermal and mechanical loading conditions. The package design and reliability analysis requires knowledge in many technical disciplines and specialized experimental methods and tools. Recently, many advanced techniques are adopted from other technical areas to be applied to the packaging applications and many experimental tools are developed correspondingly. In this paper advanced experimental techniques in electronic packaging are reviewed. The techniques and methods for mechanical analysis are emphasized as well as the new development in equipment and tools. The applications of these techniques are introduced by numerous reference publications. Most of the applications are directly related to new product development and have made significant impact in the electronics industries by assisting product designs, qualifications, reliability predictions and cycle time reductions.

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