Smartphone is emerging as the most popular electronic media in the last few years. With many high performance chips integrated inside, such mobile electronic system is already capable of performing a series of sophisticated computing which can only be carried out by a desktop computer before. Meanwhile, the large amount of heat released from the high flux heat generation also caused evident thermal discomfort to the users. As a remedy, the recently proposed method of using low melting point metal to absorb the transitory heat from the device opens a promising approach for keeping smartphone cool. To push forward the development of this new thermal management method, the present study is dedicated to present a comprehensive analysis on the cooling capacity of the metal phase change material for the thermal management of mobile phone subject to various running states, especially those when extremely long conversation time up to a half hour or longer occurs. A three dimensional phase change heat transfer model was established to simulate several typical continuous or transient heating cases often encountered in reality. It can be found that, through an optimum design among the geometric sizes of the cooling modular, the chip structures as well as the utilized amount of the metal phase change material, the method is highly useful for cooling the mobile phone running even under an unconventionally long communication period. Further, improvement for a better and compact thermal management through material innovation was also suggested.

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