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Current Issue:

Journal of Thermal Science and Engineering Applications

Foreword | June 2013
W. J. Marner
J. Thermal Sci. Eng. Appl.   doi: 10.1115/1.4023526
research-article | March 2014
Zhen Zhang, Yoav Peles and Michael K. Jensen
J. Thermal Sci. Eng. Appl.   doi: 10.1115/1.4024902
research-article | June 2014
Dong Fu, Chenn Q. Zhou and Yan Chen
J. Thermal Sci. Eng. Appl.   doi: 10.1115/1.4025946
research-article | June 2014
Jixiang Yin, Zeming He, Fuqiang Chen and Jianzong Ma
J. Thermal Sci. Eng. Appl.   doi: 10.1115/1.4025229
research-article | June 2013
Issam Mudawar
J. Thermal Sci. Eng. Appl.   doi: 10.1115/1.4023599
AMR Podcast
January 31, 2014
Applied Mechanics Reviews Audio Interview: Prof. Avram Bar-Cohen, part 1
27 minutes, 12 seconds

Prof. Avram Bar Cohen of the University of Maryland is a leading expert in thermal packaging of micro and nanosystems, and a forward thinker on technological leadership, forecasting, and management. He is an honorary member and Fellow of the ASME and a recent recipient of the 75th Anniversary Medal of ASME's Heat Transfer Division in recognition of service and contributions far beyond the call of duty. This AMR audio interview features his personal reflections on cutting edge research in thermal management and miniaturization, a career of service to the applied mechanics community, the needs for flexible funding and training mechanisms, and the Brooklyn soccer leagues.

About This Journal

The ASME Journal of Thermal Science and Engineering Applications focuses on the dissemination of information of permanent interest in applied thermal sciences and engineering and is intended to be complementary to the ASME Journal of Heat Transfer, which focuses on fundamental research. Contributions must have clear relevancy to an industry, an industrial process, or a device. While the processes and phenomena discussed may be complex, the results must have a relatively straightforward or feasible path to application. Subject areas could be as narrow as a particular phenomenon or device or as broad as a system. Papers are sought that have long-term relevance to specific applications including: original research of an applied nature; application of thermal sciences to processes or systems; technology reviews; and identification of research needs to solve industrial problems at all time and length scales. Contributions should describe research in applied areas pertaining to thermal energy transport in equipment and devices, thermal and chemical systems, and thermodynamic processes, with an emphasis on application of the fundamentals to the solution of problems faced by industry.

Editor: S.A. Sherif,
University of Florida
View Full Editorial Board
ISSN: 1948-5085
eISSN: 1948-5093
CODEN: JTSEBV
Frequency: Quarterly
Scope:
Applications in: aerospace systems, gas turbines, biotechnology, defense systems, electronic and photonic equipment, energy systems, manufacturing, refrigeration and air conditioning, homeland security systems, micro- and nanoscale devices, petrochemical processing, medical systems, energy efficiency, sustainability, solar systems, and combustion systems. Discussions of problems, issues, or solutions in established industries are welcome; however, the emphasis will be on new and emerging technologies, significant questions, pressing problems and concerns, and new methods and approaches that can be applied to industrial problems.

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