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Research Papers

Effect of Filling Ratio and Tilt Angle on the Performance of a Mini-Loop Thermosyphon

[+] Author and Article Information
Trijo Tharayil

Department of Mechanical Engineering,
Sree Buddha College of Engineering,
Pattoor, Alappuzha 690529, Kerala, India
e-mail: trijotharayil@gmail.com

Neha Gitty

Department of Mechanical Engineering,
Karunya Institute of Technology and Sciences,
Coimbatore 641114, Tamil Nadu, India
e-mail: gittyneha@gmail.com

Lazarus Godson Asirvatham

Department of Mechanical and Aerospace Engineering,
Karunya Institute of Technology and Sciences,
Coimbatore 641114, Tamil Nadu, India
e-mail: godson@karunya.edu

Somchai Wongwises

Fluid Mechanics, Thermal Engineering and Multiphase Flow Research Lab (FUTURE),
Faculty of Engineering,
Department of Mechanical Engineering,
King Mongkut’s University of Technology Thonburi,
Bangmod, Bangkok 10140, Thailand
e-mail: somchai.won@kmutt.ac.th

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the Journal of Thermal Science and Engineering Applications. Manuscript received May 20, 2018; final manuscript received April 3, 2019; published online May 20, 2019. Assoc. Editor: Ayyoub M. Momen.

J. Thermal Sci. Eng. Appl 11(6), 061013 (May 20, 2019) (11 pages) Paper No: TSEA-18-1254; doi: 10.1115/1.4043464 History: Received May 20, 2018; Accepted April 04, 2019

The thermal behavior of a compact mini-loop thermosyphon is experimentally studied at different filling ratios (20%, 30%, 40%, 50%, and 70%) and tilt angles (0 deg, 30 deg, 45 deg, 60 deg, and 90 deg) for the heat loads of 20–300 W using distilled water as the heat pipe fluid. The presence of microfins at the evaporator results in an average decrease of 37.4% and 15.3% in thermal resistance and evaporator wall temperature, respectively, compared with the evaporator with a plain surface. Both filling ratio (FR) and tilt angle influence the heat transfer performance significantly, and the best performance of the mini-loop thermosyphon is obtained at their optimum values. The thermal resistance and thermal efficiency values lie in the ranges of 0.73–0.076 K/W and 65–88.3% for different filling ratios and tilt angles. Similarly, evaporator heat transfer coefficient and evaporator wall temperature show significant variation with changes in filling ratio and tilt angle. A combination of the optimum filling ratio and tilt angle shows a lowest thermal resistance of 0.076 K/W and a highest evaporator wall temperature of 68.6 °C, which are obtained at 300 W. The experimental results recommend the use of mini-loop thermosyphon at an optimum filling ratio for electronics cooling applications, which have a heat dissipation of 20–300 W.

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Figures

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Fig. 1

(a) Mini-loop thermosyphon and (b) design of the evaporator

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Fig. 2

Loop thermosyphon-heater assembly in the horizontal orientation (0 deg)

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Fig. 3

Thermocouple positions along with other components of the experimental setup

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Fig. 4

Thermal resistance versus heat load (different filling ratios)

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Fig. 5

Evaporator wall temperature versus heat load (different filling ratios)

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Fig. 6

Effect of microfins on the thermal performance

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Fig. 7

Evaporator heat transfer coefficient versus heat load (different filling ratios)

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Fig. 8

Thermal efficiency versus heat load (different filling ratios)

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Fig. 9

Repeatability test

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Fig. 10

Comparison of thermal resistance

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Fig. 11

Thermal resistance versus heat load (different tilt angles)

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Fig. 12

Evaporator heat transfer coefficient versus heat load (different tilt angles)

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Fig. 13

Condenser heat transfer coefficient versus heat load (different tilt angles)

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Fig. 14

Evaporator wall temperature versus heat load (different tilt angles)

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Fig. 15

Effective thermal conductivity versus heat load (different tilt angles)

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Fig. 16

Thermal efficiency versus heat load (different tilt angles)

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