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Research Papers

Constructal Design of Circular Multilayer Microchannel Heat Sinks

[+] Author and Article Information
Mohammad Reza Salimpour

Department of Mechanical Engineering,
Isfahan University of Technology,
Isfahan 84156-83111, Iran;
Department of Mechanical Engineering,
University of California,
Riverside, CA 92521
e-mail: salimpour@cc.iut.ac.ir

Ahmed T. Al-Sammarraie

Mem. ASME
Department of Mechanical Engineering,
University of California,
Riverside, CA 92521
e-mail: aalsammarraie@engr.ucr.edu

Azadeh Forouzandeh

Department of Mechanical Engineering,
Isfahan University of Technology,
Isfahan 84156-83111, Iran
e-mail: a.foruzande@me.iut.ac.ir

Mahsa Farzaneh

Department of Mechanical and
Energy Engineering,
University of North Texas,
Denton, TX 76207
e-mail: mahsa.farzaneh@unt.edu

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received January 3, 2018; final manuscript received July 24, 2018; published online September 17, 2018. Assoc. Editor: Carey J. Simonson.

J. Thermal Sci. Eng. Appl 11(1), 011001 (Sep 17, 2018) (11 pages) Paper No: TSEA-18-1006; doi: 10.1115/1.4041196 History: Received January 03, 2018; Revised July 24, 2018

Based on the constructal theory concepts, an investigation is carried out to optimize circular multilayer microchannels embedded inside a rectangular heat sink with different numbers of layers and flow configurations. The lower surface of the heat sink is uniformly heated, while both pressure drop and length of the microchannel are fixed. Also, the volume of the heat sink is kept fixed for all studied cases, while the effect of solid volume fraction is examined. All the dimensions of microchannel heat sinks are optimized in a way that the maximum temperature of the microchannel heat sink is minimized. The results emphasize that using triple-layer microchannel heat sink under optimal conditions reduces the maximum temperature about 10.3 °C compared to the single-layer arrangement. Further, employing counter flow configuration in double-layer microchannel improves its thermal performance, while this effect is less pronounced in the triple-layer architecture. In addition, it is revealed that the optimal design can be achieved when the upper channels of a multilayer microchannel heat sink have bigger diameters than the lower ones. Finally, it is observed while using two layers of microchannels is an effective means for cooling improvement, invoking more layers is far less effective and hence is not recommended.

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References

Mazloomi, A. , Sharifi, F. , Salimpour, M. R. , and Moosavi, A. , 2012, “ Optimization of Highly Conductive Insert Architecture for Cooling a Rectangular Chip,” Int. Commun. Heat Mass Transfer, 39(8), pp. 1265–1271. [CrossRef]
Daneshi, M. , Zare, M. , and Salimpour, M. R. , 2013, “ Micro and Nano-Scale Conductive Tree-Structures for Cooling a Disk-Shaped Electronic Piece,” ASME J. Heat Transfer, 135(3), p. 031401. [CrossRef]
Feng, H. , Chen, L. , Xie, Z. , and Sun, F. , 2014, “ Constructal Optimization for Tree-Shaped Fluid Networks in a Disc-Shaped Area Subjected to the Surface Area Constraint,” Arabian J. Sci. Eng., 39(2), pp. 1381–1391. [CrossRef]
Hajmohammad, M. R. , Rahmani, M. , Campo, A. , and Shariatzadeh, O. J. , 2014, “ Optimal Design of Unequal Heat Flux Elements for Optimized Heat Transfer Inside a Rectangular Duct,” Energy, 68, pp. 609–616. [CrossRef]
Hajmohammadi, M. R. , Lorenzini, G. , Shariatzadeh, O. J. , and Biserni, C. , 2015, “ Evolution in the Design of V-Shaped Highly Conductive Pathways Embedded in a Heat Generating Piece,” ASME J. Heat Transfer, 137(6), p. 061001. [CrossRef]
Lorenzini, G. , Barreto, E. X. , Beckel, C. C. , Schneider, P. S. , Isoldi, L. A. , Dos Santos, E. D. , and Rocha, L. A. O. , 2016, “ Constructal Design of I-Shaped High Conductive Pathway for Cooling a Heat-Generating Medium Considering the Thermal Contact Resistance,” Int. J. Heat Mass Transfer, 93, pp. 770–777. [CrossRef]
Al-Sammarraie, A. T. , and Vafai, K. , 2017, “ Heat Transfer Augmentation Through Convergence Angles in a Pipe,” Numer. Heat Transfer, Part A: Appl., 72(3), pp. 197–214. [CrossRef]
Bello-Ochende, T. , Liebenberg, L. , and Meyer, J. P. , 2007, “ Constructal Cooling Channels for Micro-Channel Heat Sinks,” Int. J. Heat Mass Transfer, 50(21–22), pp. 4141–4150. [CrossRef]
Salimpour, M. R. , and Menbari, A. , 2014, “ Constructal Design of Cooling Channels Embedded in a Ring-Shaped Heat Generating Body,” Energy, 73, pp. 302–310. [CrossRef]
Farzaneh, M. , Salimpour, M. R. , and Tavakoli, M. R. , 2016, “ Design of Bifurcating Microchannels With/Without Loops for Cooling of Square-Shaped Electronic Components,” Appl. Therm. Eng., 108, pp. 581–595. [CrossRef]
Fan, X. , Xie, Z. , Sun, F. , and Chen, L. , 2016, “ Convective Heat Transfer Characteristics of Line-to-Line Vascular Microchannel Heat Sink With Temperature-Dependent Fluid Properties,” Appl. Therm. Eng., 93(25), pp. 606–613. [CrossRef]
Baraty Beni, S. , Bahrami, A. , and Salimpour, M. R. , 2017, “ Design of Novel Geometries for Microchannel Heat Sinks Used for Cooling Diode Lasers,” Int. J. Heat Mass Transfer, 112, pp. 689–698. [CrossRef]
Tuckerman, D. B. , and Pease, R. F. W. , 1981, “ High-Performance Heat Sinking for VLSI,” IEEE Electron Device Lett., 2(5), pp. 126–129. [CrossRef]
Wang, G. , Hao, L. , and Cheng, P. , 2009, “ An Experimental and Numerical Study of Forced Convection in a Microchannel With Negligible Axial Heat Conduction,” Int. J. Heat Mass Transfer, 52(3–4), pp. 1070–1074. [CrossRef]
Farzaneh, M. , Tavakoli, M. R. , and Salimpour, M. R. , 2017, “ Effect of Reverting Channels on Heat Transfer Performance of Microchannels With Different Geometries,” J. Appl. Fluid Mech., 10 (1), pp. 41–53. [CrossRef]
Mardani, M. , and Salimpour, M. R. , 2016, “ Optimization of Triangular Microchannel Heat Sinks Using Constructal Theory,” J. Mech. Sci. Technol., 30(10), pp. 4757–4764. [CrossRef]
Bejan, A. , 1997, “ Constructal-Theory Network of Conducting Paths for Cooling a Heat Generating Volume,” Int. J. Heat Mass Transfer, 40(4), pp. 799–816. [CrossRef]
Norouzi, E. , Mehrgoo, M. , and Amidpour, M. , 2012, “ Geometric and Thermodynamic Optimization of a Heat Recovery Steam Generator: A Constructal Design,” ASME J. Heat Transfer, 134(11), p. 111801. [CrossRef]
Salimpour, M. R. , Sharifi, F. , and Menbari, D. , 2013, “ Constructal Design for Cooling a Disc-Shaped Body Using Incomplete Inserts With Temperature-Dependent Thermal Conductivities,” Proc. IMechE Part E: J. Process Mech. Eng., 227(4), pp. 231–242. [CrossRef]
Kalbasi, R. , and Salimpour, M. R. , 2015, “ Constructal Design of Horizontal Fins to Improve the Performance of Phase Change Material Rectangular Enclosures,” Appl. Therm. Eng., 91, pp. 234–244. [CrossRef]
Kalbasi, R. , and Salimpour, M. R. , 2015, “ Constructal Design of Phase Change Material Enclosures Used for Cooling Electronic Devices,” Appl. Therm. Eng., 84, pp. 339–349. [CrossRef]
Norouzi, E. , and Amidpour, M. , 2012, “ Optimal Thermodynamic and Economic Volume of a Heat Recovery Steam Generator by Constructal Design,” Int. Commun. Heat Mass Transfer, 39(8), pp. 1286–1292. [CrossRef]
Rocha, L. A. O. , Lorente, S. , and Bejan, A. , 2002, “ Constructal Design for Cooling a Disc-Shaped Area by Conduction,” Int. J. Heat Mass Transfer, 45(8), pp. 1643–1652. [CrossRef]
Lorenzini, G. , Biserni, C. , and Rocha, L. A. O. , 2013, “ Constructal Design of X-Shaped Conductive Pathways for Cooling a Heat-Generating Body,” Int. J. Heat Mass Transfer, 58(1–2), pp. 513–520. [CrossRef]
Xia, G. , Ma, D. , Zhai, Y. , Li, Y. , Liu, R. , and Du, M. , 2015, “ Experimental and Numerical Study of Fluid Flow and Heat Transfer Characteristics in Microchannel Heat Sink With Complex Structure,” Energy Convers. Manage., 105, pp. 848–857. [CrossRef]
Muzychka, Y. S. , 2005, “ Constructal Design of Forced Convection Cooled Microchannel Heat Sinks and Heat Exchangers,” Int. J. Heat Mass Transfer, 48(15), pp. 3119–3127. [CrossRef]
Muzychka, Y. S. , 2007, “ Constructal Multi-Scale Design of Compact Micro-Tube Heat Sinks and Heat Exchangers,” Int. J. Therm. Sci., 46(3), pp. 245–252. [CrossRef]
Salimpour, M. R. , Sharifhasan, M. , and Shirani, E. , 2011, “ Constructal Optimization of the Geometry of an Array of Micro-Channels,” Int. Comm. Heat Mass Transfer, 38(1), pp. 93–99. [CrossRef]
Salimpour, M. R. , Sharifhasan, M. , and Shirani, E. , 2013, “ Constructal Optimization of Microchannel Heat Sinks With Noncircular Cross Sections,” Heat Transfer Eng., 34(10), pp. 863–874. [CrossRef]
Vafai, K. , and Zhu, L. , 1999, “ Analysis of a Two-Layered Micro Channel Heat Sink Concept in Electronic Cooling,” Int. J. Heat Mass Transfer, 42(12), pp. 2287–2297. [CrossRef]
Lu, S. , and Vafai, K. , 2016, “ A Comparative Analysis of Innovative Microchannel Heat Sinks for Electronic Cooling,” Int. Commun. Heat Mass Transfer, 76, pp. 271–284. [CrossRef]
Saidi, M. H. , and Khiabani, R. H. , 2007, “ Forced Convective Heat Transfer in Parallel Flow Multilayer Microchannels,” ASME J. Heat Transfer, 129(9), pp. 1230–1236. [CrossRef]
Hung, T.-C. , Yan, W.-M. , and Li, W.-P. , 2012, “ Analysis of Heat Transfer Characteristics of Double-Layered Microchannel Heat Sink,” Int. J. Heat Mass Transfer, 55(11–12), pp. 3090–3099. [CrossRef]
Leng, C. , Wang, X.-D. , Wang, T.-H. , and Yan, W.-M. , 2015, “ Multi-Parameter Optimization of Flow and Heat Transfer for a Novel Double-Layered Microchannel Heat Sink,” Int. J. Heat Mass Transfer, 84, pp. 359–369. [CrossRef]

Figures

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Fig. 1

Structure of the microchannel heat sink with three layers

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Fig. 2

A typical mesh independence study

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Fig. 3

Comparison of the variations of Q* of the present study with those of Salimpour et al. [28]

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Fig. 4

Structure of a single-layer microchannel heat sink

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Fig. 5

Variation of maximum temperature of single-layer microchannel heat sink versus H/G at t2/t3=1

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Fig. 6

Variation of maximum temperature of single-layer microchannel heat sink versus t2/t3 at (H/G)opt

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Fig. 7

Double-layer microchannel heat sinks: (a) parallel flow and (b) counter flow configurations

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Fig. 8

Geometrical parameters of a double-layer microchannel heat sink

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Fig. 9

Variation of Tmax versus H/G for double-layer microchannel heat sinks: (a) parallel flow and (b) counter flow configurations

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Fig. 10

Variation of Tmax versus d1/d2 for double-layer microchannel heat sinks: (a) parallel flow and (b) counter flow configurations at (H/G)opt, t2/t3 = 1, and t2/t4 = 1

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Fig. 11

Variation of Tmax versus t2/t4 for double-layer microchannel heat sinks: (a) parallel flow and (b) counter flow configurations at (H/G)opt, (d1/d2)opt, and t2/t3 = 1

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Fig. 12

Variation of Tmax versus t2/t3 for double-layer microchannel heat sinks: (a) parallel flow and (b) counter flow configurations at (H/G)opt, (d1/d2)opt, and (t2/t4)opt

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Fig. 13

Structure of the triple-layer microchannel heat sink

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Fig. 14

Flow configurations in triple-layer microchannel heat sink: (a) case I, (b) case II, and (c) case III

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Fig. 15

Variation of Tmax versus H/G for triple-layer microchannel heat sinks: (a) case I, (b) case II, and (c) case III at d1/d2 = 1, d1/d3 = 2, t2/t3 = 1, and t2/t4 = 1

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Fig. 16

Variation of Tmax versus d1/d2 for triple-layer microchannel heat sinks: (a) case I, (b) case II, and (c) case III at (H/G)opt, d1/d3 = 2, t2/t3 = 1, and t2/t4 = 1

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Fig. 17

Variation of Tmax versus d1/d3 for triple-layer microchannel heat sinks: (a) case I, (b) case II, and (c) case III at (H/G)opt, (d1/d2)opt, t2/t3 = 1, and t2/t4 = 1

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Fig. 18

Variation of Tmax versus t2/t4 for triple-layer microchannel heat sinks: (a) case I, (b) case II, and (c) case III at (H/G)opt, (d1/d2)opt, (d1/d3)opt, and t2/t3 = 1

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Fig. 19

Variation of Tmax versus t2/t3 for triple-layer microchannel heat sinks: (a) case I, (b) case II, and (c) case III at (H/G)opt, (d1/d2)opt, (d1/d3)opt, and (t2/t4)opt

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