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Research Papers

Thermal Conductivity and Mechanical Properties of Low-Density Silicone Rubber Filled With Al2O3 and Graphene Nanoplatelets

[+] Author and Article Information
Yingchun Zhang, Liye Zhang, Huaqing Xie

School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China

Wei Yu

School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: yuwei@sspu.edu.cn

Junshan Yin, Jingkang Wang

Shanghai Yueda New Material Science
and Technology Co. Ltd.,
Shanghai 201209, China

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received January 6, 2017; final manuscript received April 4, 2017; published online August 28, 2017. Assoc. Editor: Jingchao Zhang.

J. Thermal Sci. Eng. Appl 10(1), 011014 (Aug 28, 2017) (5 pages) Paper No: TSEA-17-1003; doi: 10.1115/1.4036797 History: Received January 06, 2017; Revised April 04, 2017

A simple approach is developed to obtain a multiscale network of heat conducting by filling spherical alumina (S-Al2O3) and graphene nanoplatelets (GnPs) into silicone rubber (SR). This unique structure effectively minimizes the thermal contact resistance between fillers and matrix. The physical properties of the composites are characterized by thermal conductivity, density, and tensile strength. A high thermal conductivity of 3.37 Wm−1 K−1 has been achieved, which is 47.1% higher than the single filler at the same loading. A strong and obvious synergistic effect has been observed as S-Al2O3 and GnPs filled into silicone rubber matrix. It is interesting that the composites with GnPs have the lower density (2.62 g/cm3, reduced by 6%) and the superior tensile performance, compared to silicone rubber composite with neat S-Al2O3. The composites have the potential applications in heat dissipation of light-emitting diode.

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Figures

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Fig. 1

Process flow diagram of thermal conductive silicone rubber

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Fig. 2

SEM images of (a) spherical Al2O3 particles, (b) graphene nanoplatelets, and (c) silicone rubber composite with Al2O3 and GnPs

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Fig. 3

Comparison of thermal conductivity of silicone rubber filled with and without GnPs at different filler loading

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Fig. 4

Thermal conductivity enhancement and synergistic effects of silicone rubber filled with GR at different filler loading

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Fig. 5

Schematic diagrams of the distribution of (a) spherical-Al2O3 particles, (b) graphene nanoplatelets, and (c) hybrid filler of S-Al2O3/GnPs used in silicone rubber

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Fig. 6

Tensile properties of neat silicone rubber filled with S-Al2O3 or 1 wt % GnPs at different filler loading

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Fig. 7

The density of thermal conductivity silicone rubber as a function of mass fraction of S-Al2O3 and GnPs

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