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research-article

Thermal conductivity and mechanical properties of low density silicone rubber filled with Al2O3 and graphene nanoplatelets

[+] Author and Article Information
Yingchun Zhang

School of Environment and Materials Engineering, College of Engineering, Shanghai Polytechnic University, Shanghai, 201209, China
2275102733@qq.com

Wei Yu

School of Environment and Materials Engineering, College of Engineering, Shanghai Polytechnic University, Shanghai, 201209, China
yuwei@sspu.edu.cn

Liye Zhang

School of Environment and Materials Engineering, College of Engineering, Shanghai Polytechnic University, Shanghai, 201209, China
1508381320@qq.com

Junshan Yin

Shanghai Yueda New Material Science and Technology co. Ltd., Shanghai, 201209, China
531941281@qq.com

Jingkang Wang

Shanghai Yueda New Material Science and Technology co. Ltd., Shanghai, 201209, China
826380587@qq.com

Huaqing Xie

School of Environment and Materials Engineering, College of Engineering, Shanghai Polytechnic University, Shanghai, 201209, China
hqxie@sspu.edu.cn

1Corresponding author.

ASME doi:10.1115/1.4036797 History: Received January 06, 2017; Revised April 04, 2017

Abstract

A simple approach is developed to obtain a multiscale network of heat conducting by filling spherical alumina (S-Al2O3) and graphene nanoplatelets (GnPs) into silicon rubber. This unique structure effectively minimizes the thermal contact resistance between fillers and interface. The physical properties of the composites are characterized by thermal conductivity, density and tensile strength. A high thermal conductivity of 3.37Wm-1K-1 has been achieved, which is 47.1% higher than the single filler at the same loading. A strong and obvious synergistic effect has been observed as S-Al2O3 and GnPs filled into silicon rubber matrix. It is interesting that the composites with GnPs have the lower density (2.62g/cm3, reduced by 6%) and the superior tensile performance, compared to silicone rubber composite with neat S-Al2O3. The composites have the potential applications in heat dissipation of light-emitting diode.

Copyright (c) 2017 by ASME
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