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Research Papers

Enhanced Thermal Performance of Internal Y-Shaped Bifurcation Microchannel Heat Sinks With Metal Foams

[+] Author and Article Information
Han Shen, Xueting Liu, Hongbin Yan

Department of Mechanical
and Power Engineering,
School of Marine Science and Technology,
Northwestern Polytechnical University,
P.O. Box 24,
Xi'an 710072, Shannxi, China

Gongnan Xie

Department of Mechanical
and Power Engineering,
School of Marine Science and Technology,
Northwestern Polytechnical University,
P.O. Box 24,
Xi'an 710072, Shannxi, China
e-mail: xgn@nwpu.edu.cn

Bengt Sunden

Division of Heat Transfer,
Department of Energy Science,
Lund University,
Lund SE-22100, Sweden
e-mail: bengt.sunden@energy.lth.se

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received July 25, 2016; final manuscript received December 20, 2016; published online June 27, 2017. Assoc. Editor: Giulio Lorenzini.

J. Thermal Sci. Eng. Appl 10(1), 011001 (Jun 27, 2017) (8 pages) Paper No: TSEA-16-1210; doi: 10.1115/1.4036767 History: Received July 25, 2016; Revised December 20, 2016

Internal Y-shaped bifurcation has been proved to be an advantageous way on improving thermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, large surface area, and high thermal conductivity. In this paper, different parameters of metal foams in Y-shaped bifurcation microchannel heat sinks are designed and investigated numerically. The effects of Reynolds number, porosity of metal foam, and the pore density (PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is found that the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibit better heat transfer enhancement and overall thermal performance. This research provides broad application prospects for heat sinks with metal foam in the thermal management of high power density electronic devices.

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Figures

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Fig. 1

Schematic pictures of rectangular straight microchannel heat sinks

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Fig. 2

Schematic picture of the internal Y-shaped bifurcation microchannel with metal foam (case 1). The internal Y-shaped bifurcation microchannel with L0/L = 5/7.

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Fig. 3

Thermal performance compared with a previous study [20]

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Fig. 4

Samples of different pore density aluminum foams with a graduated millimeter scale [33]

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Fig. 5

Temperature distributions on the bottom wall for case 1(c) for five different inlet velocities compared with case 0. The unit of temperature is Kelvin (see color figure online).

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Fig. 6

Local pressure drop for all five different Reynolds numbers of case 1 along the streamwise flow direction at x = 0 and y = 0.14 mm, u0 = 1.32 m/s. The unit of pressure drop is kPa.

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Fig. 7

Distribution of the local velocity along the streamwise direction in the central x–z cross section (y = 0.14 mm) for five different Reynolds numbers

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Fig. 8

The average Nusselt number of microchannel heat sinks versus Reynolds number for all the five cases

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Fig. 9

The bottom temperature along the spanwise direction at the entrance of the internal Y-shaped bifurcation with five different porosities of the metal foam

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Fig. 10

Contours of the distribution of the velocity along thestreamwise direction for the inlet velocity u0 = 1.00 m/s (Re = 391.60) in the streamwise–spanwise (x–z) planes at the height of 0.25 mm of the microchannel for the four cases with PPI = 10, 20, 30, and 40, respectively. The dimension of length is millimeter.

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Fig. 11

Local pressure drop for all the four different values ofPPI along the streamwise flow direction at x = 0 and y = 0.14 mm, u0 = 1.00 m/s. The unit of pressure drop is kPa. The dimension of streamwise distance is millimeter.

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Fig. 12

The overall thermal resistance of microchannel heat sinks with the inlet Reynolds number for the five cases. The unit of thermal resistance is K/W.

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