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research-article

Enhanced Thermal Performance of Internal Y-shaped Bifurcation Microchannel Heat Sinks with Metal Foams

[+] Author and Article Information
Han Shen

Department of Mechnical and Power Engineering, School of Marine Science and Technology, Northwestern Polytechnical University, P.O. Box 24, Xi'an, 710072, Shannxi, China
shenhan@mail.nwpu.edu.cn

Xueting Liu

Department of Mechnical and Power Engineering, School of Marine Science and Technology, Northwestern Polytechnical University, P.O. Box 24, Xi'an, 710072, Shannxi, China
lxt@mail.nwpu.edu.cn

Hongbin Yan

Department of Mechnical and Power Engineering, School of Marine Science and Technology, Northwestern Polytechnical University, P.O. Box 24, Xi'an, 710072, Shannxi, China
hbyan@nwpu.edu.cn

Gongnan Xie

Department of Mechnical and Power Engineering, School of Marine Science and Technology, Northwestern Polytechnical University, P.O. Box 24, Xi'an, 710072, Shannxi, China
ConanASME@gmail.com

Bengt Sunden

Divison of Heat Transfer, Department of Energy Science, Lund University, SE-22100, Lund, Sweden
bengt.sunden@energy.lth.se

1Corresponding author.

ASME doi:10.1115/1.4036767 History: Received July 25, 2016; Revised December 20, 2016

Abstract

Internal Y-shaped bifurcation has been proved to be an advantageous way on improving thermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, large surface area and high thermal conductivity. In this paper, different parameters of metal foams in Y-shaped bifurcation microchannel heat sinks are designed and investigated numerically. The effects of Reynolds number, porosity of metal foam, and the pore density (PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is found that the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibit better heat transfer enhancement and overall thermal performance. This research provides broad application prospects for heat sinks with metal foam in the thermal management of high power density electronic devices.

Copyright (c) 2017 by ASME
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