Research Papers

A Passive and Remote Heat Transfer Solution for Avionics Thermal Management

[+] Author and Article Information
Steve Q. Cai

Teledyne Scientific Company,
1049 Camino Dos Rios,
Thousand Oaks, CA 91360
e-mail: qingjun.cai@teledyne.com

Avijit Bhunia

Teledyne Scientific Company,
1049 Camino Dos Rios,
Thousand Oaks, CA 91360

Julie F. Asfia

9172 Guss Drive,
Huntington Beach, CA 92646
e-mail: jasfia@yahoo.com

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received July 13, 2016; final manuscript received October 21, 2016; published online February 23, 2017. Assoc. Editor: Mohamed S. El-Genk.

J. Thermal Sci. Eng. Appl 9(2), 021009 (Feb 23, 2017) (6 pages) Paper No: TSEA-16-1199; doi: 10.1115/1.4035500 History: Received July 13, 2016; Revised October 21, 2016

A heat pipe utilizes liquid–vapor phase change mechanism to efficiently transfer heat. Among different heat pipes, loop heat pipe (LHP) and pulsating heat pipe (PHP) are known to be capable of high heat flux/high load heat transfer. In this article, LHP and PHP heat transfer systems are combined to achieve passive, reliable, and remote/long-distance heat transfer for thermal management of modern avionics systems. Aiming at this goal, a 2 m long LHP is developed to transport heat from the avionics chassis to the remote heat rejection site. To reduce inner saturation pressure and ensure structural safety at high operating temperature, water is used as the operating fluid in LHP. Within the avionics chassis, conduction heat transfer is enhanced by sandwiching a PHP with two printed circuit boards (PCBs) and solder-bonding them. Each PHP/PCB assembly is 20 cm long and 12.5 cm wide, with electrical heaters mounted on both sides to mimic electronic heat dissipation. Heat transfer demonstration of the LHP and PHP combo system is conducted in a lab environment with input power varying from 100 to 400 W. For all the three PHP/PCB assemblies set in the avionic chassis, heat source temperature is maintained below the required 150 °C even when heat dissipation is twice as high as the state-of-the-art (and coolant temperature is 50 °C). This combo heat transfer system reduces power consumption and increases reliability, enabling the avionic system operation in harsh environments.

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Fig. 5

PHP and PCB assembly: (a) schematic diagram of the cross sections and (b) test prototype

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Fig. 6

PHP/PCB assemblies in avionic chassis

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Fig. 4

A 2 m long LHP prototype with the maximum heat transfer capability of 800 W

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Fig. 3

Multilayer wick structures in LHP

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Fig. 2

Schematic diagram of loop heat pipe

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Fig. 1

PHP/LHP combo system

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Fig. 7

Long-distance heat transfer system for avionic thermal management: (a) integrated PHP/LHP combo system and (b) joint between the chassis mimic and the LHP evaporator

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Fig. 8

Locations of temperature measurement points

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Fig. 9

Combo system performance at 100 W

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Fig. 10

Combo system performance at 200 W

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Fig. 11

Combo system performance at 300 W

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Fig. 12

Combo system performance at 400 W



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