Modern consumer electronic trends point to a demand for thinner and more portable electronic devices. Conventional cooling systems of these portable electronic devices are challenging to miniaturize in thin profile applications that are typically on the order of several millimeters in thickness. In order to overcome some of these challenges, a synthetic jet, which is also considered as micro fluidic device, is developed. This device which operates based on Piezo electricity is called Dual Cooling Jet (DCJ). DCJ disturbs the boundary layer over a hot component and hence increases heat transfer compare to conventional blower. DCJ is typically defined as a device using a partially enclosed cavity with oscillating walls/diaphragms to create alternating suction and ejection of fluid across an interface or orifice. In this work, the results of cooling performance investigation of DCJ are shown and compared with natural convection cooling. Also, several experiments have been done to study the cooling effect of DCJ at different configuration with respect to heat source and the results are compared. At the end, the effects of heat source size is investigated which are helpful to understand how effective DCJ is when used for cooling several size chips. In addition, the results of this work show that DCJ can be combined with low profile heat sink as a promising next generation ultra thin thermal solution module.