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Research Papers

An Experimental Investigation of an Oscillating Heat Pipe Heat Spreader

[+] Author and Article Information
F. F. Laun, H. Lu

Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211

H. B. Ma

LaPierre Professor
Fellow ASME
Department of Mechanical and
Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
e-mail: mah@missouri.edu

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received September 30, 2013; final manuscript received January 25, 2014; published online January 21, 2015. Assoc. Editor: Jovica R. Riznic.

J. Thermal Sci. Eng. Appl 7(2), 021005 (Jun 01, 2015) (5 pages) Paper No: TSEA-13-1163; doi: 10.1115/1.4026815 History: Received September 30, 2013; Revised January 25, 2014; Online January 21, 2015

With ever increasing technological advances in electronics, modern computer components continue to produce higher power densities that present a challenge to thermal management. A radial flat-plate oscillating heat pipe (RFP-OHP) heat spreader is investigated to study the effect of central heating on the heat transport capability in an OHP. The investigated OHP has dimensions of 100 mm × 100 mm × 2.5 mm with central heating using a 30 mm × 30 mm heater. Experimental results show that when heat is added to the center section of one side of the radial flat-plate OHP, and when heat is removed from the whole surface of another side of the heat pipe, the startup power for the oscillating motion increases. In addition, the spacer effect on the heat transport capability including the startup is investigated experimentally. The spacer added between the cooling block and OHP could lower the startup power for oscillatory motion. When compared to a copper slab of the same dimensions in the same test configuration, the temperature difference for the OHP with and without the additional copper spacer was reduced by a maximum of 46% and 25%, respectively, at a power input of 525 W and a heat flux of 58 W/cm2.

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References

Figures

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Fig. 5

Average evaporator and condenser temperatures versus time using the spacer with no hole for: (a) 225 W and (b) 250 W

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Fig. 4

Average temperature difference versus power for the OHP and copper slab with and without the copper spacer

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Fig. 1

Radial flat-plate oscillating heat pipe with Tesla check valves

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Fig. 3

Oscillating heat pipe test section

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Fig. 2

Schematic of oscillating heat pipe with: (a) thermocouple placemen and (b) experimental setup

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Fig. 6

Average evaporator and condenser temperatures versus time for: (a) 525 W using the spacer with no hole and (b) 525 W using the spacer with hole

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Fig. 7

Average evaporator temperature versus time for 525 W with complete contact with the cooling block

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Fig. 8

Average evaporator temperature versus time for 525 W with additional copper spacer

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Fig. 9

Average evaporator temperature versus time for 150 W with additional copper spacer

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Fig. 10

Average evaporator temperature versus time for 150 W with complete contact with the cooling block

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