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Research Papers

Fluid Flow and Heat Transfer in a Novel Microchannel Heat Sink Partially Filled With Metal Foam Medium

[+] Author and Article Information
E. Farsad

Iranian National Center for Laser
Science and Technology,
Tehran, Iran
e-mail: ehsanfarsad@yahoo.com and farsad@inlc.ir

S. P. Abbasi

Iranian National Center for Laser
Science and Technology,
Tehran, Iran

Iranian National Center for Laser
Science and Technology,
Tehran, Iran

1Corresponding author.

Manuscript received July 26, 2012; final manuscript received September 5, 2013; published online January 24, 2014. Assoc. Editor: Ravi Prasher.

J. Thermal Sci. Eng. Appl 6(2), 021011 (Jan 24, 2014) (7 pages) Paper No: TSEA-12-1115; doi: 10.1115/1.4025823 History: Received July 26, 2012; Revised September 05, 2013

Performance of microchannel heatsink (MCHS) partially filled with foam is investigated numerically. The open cell copper foams have the porosity and pore density in the ranges of 60–90% and 60–100 PPI (pore per inch), respectively. The three-dimensional steady, laminar flow, and heat transfer governing equations are solved using finite volume method. The performance of microchannel heatsink is evaluated in terms of overall thermal resistance, pressure drop, and heat transfer coefficient and temperature distribution. It is found that the results of the surface temperature profile are in good agreement with numerical data. The results show the microchannel heatsink with insert foam appears to be good candidates as the next generation of cooling devices for high power electronic devices. The thermal resistance for all cases decreases with the decrease in porosity. The uniformity of temperature in this heatsink is enhanced compared the heatsink with no foam. The thermal resistance versus the pumping power is depicted, it is found that 80% is the optimal porosity for the foam at 60 PPI with a minimum thermal resistance 0.346 K/W. The results demonstrate the microchannel heatsink partially filled with foam is capable for removing heat generation 100 watt over an area of 9 × 10−6 m2 with the temperature of heat flux surface up to 59 °C.

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Figures

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Fig. 1

Schematic of MCHS: (a) an Exploded view of five sheets of MCHS and (b) the isometric view of MCHS

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Fig. 2

The finite volume mesh of the half of the MCHS

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Fig. 3

The average temperature of heated surface

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Fig. 4

Comparison among the simulation results and the results of Dix [24] for surface temperature profile

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Fig. 5

Pressure drop across the microchannel heat sink with insert porous: (a) 60 PPI and (b) 100 PPI

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Fig. 6

Pressure drop across the microchannel heat sink in different PPI

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Fig. 7

The average heat transfer coefficient of MCHS with foam 60 PPI

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Fig. 8

The average thermal resistance of MCHS

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Fig. 9

Comparison of thermal resistance of MCHS with insert foam and without insert foam

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Fig. 10

The temperature difference distribution between heated wall and inlet coolant at X–Y plane: MCHS with insert foam (a) ε = 60%, (b) ε = 80%, and (c) without insert foam (ε = 100%)

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Fig. 11

The thermal resistance of MCHS with insert foam as a function of pressure drop

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