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Research Papers

Design and Optimization of Multiple Microchannel Heat Transfer Systems

[+] Author and Article Information
Jingru Zhang

Department of Mechanical and
Aerospace Engineering,
Rutgers, The State University of New Jersey,
Piscataway, NJ 08854

Po Ting Lin

Institute of Biomedical Technology,
R&D Center for Microsystem Reliability,
Chung Yuan Christian University,
Chungli City, Taiwan 32032
email: potinglin@cycu.edu.tw

Yogesh Jaluria

Department of Mechanical and
Aerospace Engineering,
Rutgers, The State University of New Jersey,
Piscataway, NJ 08854
e-mail: jaluria@jove.rutgers.edu

Manuscript received January 15, 2013; final manuscript received May 9, 2013; published online October 21, 2013. Assoc. Editor: Mehmet Arik.

J. Thermal Sci. Eng. Appl 6(1), 011004 (Oct 21, 2013) (10 pages) Paper No: TSEA-13-1008; doi: 10.1115/1.4024706 History: Received January 15, 2013; Revised May 09, 2013

In this paper, two different configurations of multiple microchannel heat sinks, with fluid flow, are investigated for heat removal: straight and U-shaped channel designs. Numerical models are utilized to study the multiphysics behavior in the microchannels and these are validated by comparisons with experimental results. The main focus of this work is on the design and optimization of these systems and to outline the methodology that may be used for other similar thermal systems. Three responses, including thermal resistance, pressure drop, and maximum temperature, are parametrically modeled with respect to various design variables and operating conditions such as dimensions of the channels, total number of channels, and flow rate. Multi-objective optimization problems, which minimize the thermal resistance and the pressure drop simultaneously, are formulated and studied. Physical constraints in terms of channel height, maximum temperature, and pressure are further investigated. The Pareto frontiers are studied and the trade-off behavior between the thermal resistance and the pressure drop are discussed. Characteristic results are presented and discussed.

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References

Kou, H. S., Lee, J. J., and Chen, C. W., 2008, “Optimum Thermal Performance of Microchannel Heat Sink by Adjusting Channel Width and Height,” Int. Commun. Heat Mass Transfer, 35(5), pp. 577–582. [CrossRef]
Tuckerman, D. B., and Pease, R. F. W., 1981, “High Performance Heat Sinking for Vlsi,” IEEE Electron Device Lett., 2(5), pp. 126–129. [CrossRef]
Steinke, M. E., Kandlikar, S. G., Magerlein, J. H., Colgan, E. G., and Raisanen, A. D., 2006, “Development of an Experimental Facility for Investigating Single-Phase Liquid Flow in Microchannels,” Heat Transfer Eng., 27(4), pp. 41–52. [CrossRef]
Wei, X. J., and Joshi, Y., 2004, “Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components,” ASME J. Electron. Packag., 126(1), pp. 60–66. [CrossRef]
Fedorov, A. G., and Viskanta, R., 2000, “Three-Dimensional Conjugate Heat Transfer in the Microchannel Heat Sink for Electronic Packaging,” Int. J. Heat Mass Transfer, 43(3), pp. 399–415. [CrossRef]
Husain, A., and Kim, K.-Y., 2007, “Design Optimization of Micro-Channel for Micro Electronic Cooling,” ASME 2007 5th International Conference on Nanochannels, Microchannels, and Minichannels (ICNMM2007) Puebla, Mexico, Paper No. ICNMM2007-30053, pp. 201–207.
Li, J., Peterson, G. P., and Cheng, P., 2004, “Three-Dimensional Analysis of Heat Transfer in a Micro-Heat Sink With Single Phase Flow,” Int. J. Heat Mass Transfer, 47(19–20), pp. 4215–4231. [CrossRef]
Li, Z. G., Huai, X. L., Tao, Y. J., and Chen, H. Z., 2007, “Effects of Thermal Property Variations on the Liquid Flow and Heat Transfer in Microchannel Heat Sinks,” Appl. Therm. Eng., 27(17–18), pp. 2803–2814. [CrossRef]
Lin, P. T., Jaluria, Y., and Gea, H. C., 2009, “Parametric Modeling and Optimization of Chemical Vapor Deposition Process,” ASME J. Manuf. Sci. Eng., 131(1), p. 011011. [CrossRef]
Lin, P. T., Gea, H. C., and Jaluria, Y., 2010, “Systematic Strategy for Modeling and Optimization of Thermal Systems With Design Uncertainties,” Front. Heat Mass Transfer, 1, p. 013003.
Zhang, J., Prakash, S., and Jaluria, Y., 2010, “An Experimental Study on the Effect of Configuration of Multiple Microchannels on Heat Removal for Electronic Cooling,” 2010 14th International Heat Transfer Conference (IHTC14), Washington, DC, Paper No. IHTC14-22234, pp. 473–480.
Zhang, J., Jaluria, Y., Zhang, T., and Jia, L., 2013, “Combined Experimental and Numerical Study for Multiple Microchannel Heat Transfer System,” Numer. Heat Transfer, Part B64, pp. 1–13. [CrossRef]
Zhang, J. and Jaluria, Y., 2011, “Combined Experimental and Numerical Study of a New Configuration of Multiple Microchannel Heat Sink for Heat Removal,” International Mechanical Engineering Congress and Exposition, Denver, CO, Paper No. IMECE2011-62535.
Van Beers, W. C. M., and Kleijnen, J. P. C., 2003, “Kriging for Interpolation in Random Simulation,” J. Oper. Res. Soc., 54(3), pp. 255–262. [CrossRef]
Van Beers, W. C. M., and Kleijnen, J. P. C., 2004, Proceedings of the 36th Conference on Winter Simulation, pp. 113–121.
Dill, E. H., 2006, Continuum Mechanics: Elasticity, Plasticity, Viscoelasticity, CRC Press, Boca Raton, FL.
Kandlikar, S. G., 2003, “Microchannels and Minichannels: History, Terminology, Classification and Current Research Needs,” ASME 2003 1st International Conference on Microchannels and Minichannels (ICMM2003), Rochester, NY, Paper No. ICMM2003-1000, pp. 1–6.
Deb, K., 2001, Multi-Objective Optimization Using Evolutionary Algorithms of Wiley-Interscience Series in Systems and Optimization, John Wiley & Sons, LTD, Chichester, UK, pp. 50–57.
Parker Hannifin Corp., “Data Sheet of Miniature Diaphragm Pumps: LTC Series 650mLPM Free Flow Mini Pumps (liquids),” Available at: http://www.parker.com/precisionfluidics

Figures

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Fig. 1

Sketch of the straight microchannel heat sink model

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Fig. 2

Sketch of the U-shaped microchannel heat sink model

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Fig. 3

Comparison of experimental and numerical results for the outlet temperature

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Fig. 4

Comparison of experimental and numerical results for the pressure drop

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Fig. 5

Surfaces at uniform values of the thermal resistance (isosurfaces) for straight channels

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Fig. 6

Isosurfaces of pressure drop for straight channels

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Fig. 7

Isosurfaces of maximum temperatures for straight channels

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Fig. 8

Isosurfaces of thermal resistance for U-shaped channels

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Fig. 9

Pressure drop for U-shaped channels

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Fig. 10

Maximum temperature for U-shaped channels

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Fig. 11

Pareto frontiers for example 1

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Fig. 12

Pareto frontiers for example 2

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Fig. 13

Pareto frontiers for example 3

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Fig. 14

Pareto frontiers for example 4

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