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Research Papers

Heat Transfer During Multiwire Sawing of Silicon Wafers

[+] Author and Article Information
Lars Johnsen

SINTEF ICT, Box 4760 Sluppen, NO-7465 Trondheim, NorwayLars.Johnsen@sintef.no

Jan Erik Olsen

SINTEF Materials and Chemistry, Box 4760 Sluppen, NO-7465 Trondheim, NorwayJan.E.Olsen@sintef.no

Trond Bergstrøm

SINTEF Materials and Chemistry, Box 4760 Sluppen, NO-7465 Trondheim, NorwayTrond.H.Bergstrom@sintef.no

Kay Gastinger

SINTEF ICT, Box 4760 Sluppen, NO-7465 Trondheim, NorwayKay.Gastinger@ntnu.no

J. Thermal Sci. Eng. Appl 4(3), 031006 (Jul 16, 2012) (7 pages) doi:10.1115/1.4006591 History: Received August 09, 2011; Revised February 29, 2012; Published July 16, 2012; Online July 16, 2012

During sawing of silicon wafers for the photovoltaic industry, the variations in temperature will influence the process performance and surface quality of the wafers. To investigate the significance of this effect, the temperature field and heat transfer have been studied experimentally and computationally. Among others, it is found that the temperature typically can increase from 30 °C at the inlet to 65 °C at the outlet of the sawing channel. It is also shown that viscous dissipation is by far the most significant heating source in the process.

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Copyright © 2012 by American Society of Mechanical Engineers
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Figures

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Figure 1

Principle configuration of a multiwire saw. The Meyer Burger DS265 has two wire guides, on the wire entrance side and on the wire exit side of the block/ingot.

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Figure 2

Front view of a silicon block during sawing. The wire is moving into the viewing plane and is indicated by black circles. The slurry is seen as dark gray and silicon block as light gray.

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Figure 3

Modeling geometry with boundary regions and snapshot of computational grid

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Figure 4

Temperature fields from simulations (left) and measurements (right) when wire is half way through the block

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Figure 5

Profiles of measured temperature, calculated slurry temperature, and calculated wire temperature along the saw wire from the wire entrance to the wire exit when the wire is halfway through the block

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Figure 6

Measured temperature along the wire loop. Arrows indicate slurry application.

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Figure 8

Viscosity profiles of slurry from the inlet side through the sawing channel to the exit side

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Figure 7

Development of temperature during a saw run. Measured temperatures just above the wire at three positions and the calculated maximum temperature are shown.

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