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Research Papers

System-Level Metrics for Thermal Management Technology

[+] Author and Article Information
Stephen A. Solovitz1

 Washington State University, 14204 NE Salmon Creek Avenue, VELS 130F, Vancouver, WA 98686 e-mail: stevesol@vancouver.wsu.edu General Electric Global Research, One Research Circle, Niskayuna, NY 12309 e-mail: arik@ge.com

Mehmet Arik

 Washington State University, 14204 NE Salmon Creek Avenue, VELS 130F, Vancouver, WA 98686 e-mail: stevesol@vancouver.wsu.edu General Electric Global Research, One Research Circle, Niskayuna, NY 12309 e-mail: arik@ge.com

1

Corresponding author.

J. Thermal Sci. Eng. Appl 3(3), 031009 (Aug 12, 2011) (12 pages) doi:10.1115/1.4004486 History: Received January 07, 2011; Revised June 27, 2011; Published August 12, 2011; Online August 12, 2011

With the seamless advancements in modern electronics and shrinking thermal real estate, a number of candidate thermal technologies have been developed. As system designers evaluate these methods, they require unambiguous comparisons in order to properly assess the positives and negatives of advanced solutions. The most commonly used metrics, particularly thermal resistance, are limited in their applicability, especially because they account for only for single factors like the temperature of the heated device. To improve these comparisons, a new volumetric enhancement factor, EFv , is proposed, which can be justified based on lumped capacitance arguments. When coupled with the thermodynamic coefficient of performance, EFv allows a simple comparison that relates thermal performance, system input needs, and system size simultaneously. Using these metrics, several advanced technologies are compared, demonstrating that liquid cooling using microchannels can be in excess of 1000 times more effective than air cooling methods.

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Copyright © 2011 by American Society of Mechanical Engineers
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Figures

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Figure 1

Examples of Advanced Thermal Technologies: (a) synthetic jets [1] and (b) microchannels [2]

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Figure 2

Schematic of typical cooling system

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Figure 3

Enhancement factor for various power removals for a range of thermal technologies

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Figure 4

Coefficient of performance for various power removals for a range of thermal technologies

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Figure 5

Volumetric enhancement factors for various power removals for a range of thermal technologies

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Figure 6

Volumetric enhancement factors for various coefficients of performance for a range of thermal technologies

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Figure 7

Specific enhancement factors for various power removals for a range of thermal technologies

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Figure 8

Integrated system performance metric for various power removals for a range of thermal technologies

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