0
Research Papers

Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling

[+] Author and Article Information
Hemin Hu, Jiahui Zhang, Xiaoze Du, Lijun Yang

School of Energy and Mechanical Engineering,  North China Electric Power University, Beijing 102206, China Siemens Industry, Inc., I DT LD AM Global Headquarters, 100 Sagamore Hill Road, Pittsburgh, PA 15239 e-mail: jiahui.zhang@siemens.comSchool of Energy and Mechanical Engineering,  North China Electric Power University, Beijing 102206, China e-mail: duxz@ncepu.edu.cnSchool of Energy and Mechanical Engineering,  North China Electric Power University, Beijing 102206, China

J. Thermal Sci. Eng. Appl 3(2), 021001 (Jul 13, 2011) (9 pages) doi:10.1115/1.4004079 History: Received August 06, 2010; Revised March 29, 2011; Published July 13, 2011; Online July 13, 2011

Liquid-cooled heat sink (cold plate) used for power electronics cooling is numerically studied. Thermal performance and hydraulic resistance are analyzed, with emphasis on geometric construction of cooling channels. Two heat transfer enhancing channel shapes are investigated, such as alternating elliptical channel and alternating rectangular channel (AR-C). Their performances are compared with that of three traditional straight channel shapes, as straight circular channel, straight elliptical channel, and straight rectangular channel. A heat sink with uniform and discrete heat sources is studied. Thermal and hydraulic characteristics in the heat sink are simulated using computational fluid dynamics approach, with water as coolant. The results show that the AR-C has the highest thermal performance with a little penalty on pressure drop, considering fixed channel hydraulic diameter and coolant volumetric flow rate. Geometry optimization is investigated for the AR-C, as well as the effect of channel density. It is found that higher channel density can improve both thermal performance and hydraulic resistance. It is concluded that alternating channel can improve cold plate performance and should be taken into application to power electronics cooling.

FIGURES IN THIS ARTICLE
<>
Copyright © 2011 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 1

Configurations of alternating channels: (a) schematic diagram of AE-C; (b) schematic diagram of AR-C

Grahic Jump Location
Figure 2

Physical model of the heat sink: (a) schematic diagram of heat sink; (b) computational domain of zone 1; (c) computational domain of zone 2

Grahic Jump Location
Figure 3

Nusselt number variation with different mesh sizes: (a) Nusselt number variation along X as different mesh sizes for SC-C; (b) average Nusselt number variation as different mesh sizes for AE-C

Grahic Jump Location
Figure 4

y+ variation along X

Grahic Jump Location
Figure 5

Cross-sectional grid of computational domain

Grahic Jump Location
Figure 6

Thermal validation of numerical simulation for AE-C

Grahic Jump Location
Figure 7

Comparisons of the simulation results and the empirical correlations: (a) heat transfer performance; (b) flow resistance

Grahic Jump Location
Figure 8

Heat sink performance with five channel shapes used in zone 1: (a) pressure drop of liquid along X; (b) average temperature on heating surface of heat sinks along X

Grahic Jump Location
Figure 9

Heat sink performance with five channel shapes used in zone 2: (a) pressure drop of liquid along X; (b) average temperature on heating surface of heat sinks along X

Grahic Jump Location
Figure 10

Multilongitudinal vortex at transitional region between contraction and expansion in elliptical channel

Grahic Jump Location
Figure 11

Effect of pitch length on heat sink performances: (a) pressure drop of liquid along X; (b) heating surface temperature of heat sink along X

Grahic Jump Location
Figure 12

Effect of cross-sectional aspect ratio on heat sink performances: (a) pressure drop of liquid along X; (b) heating surface temperature of heat sink along X

Grahic Jump Location
Figure 13

Effect of channel density on heat sink performances: (a) pressure drop of liquid along X; (b) heating surface temperature of heat sink along X

Grahic Jump Location
Figure 14

Pressure and temperature distributions in channel: (a) pressure variation of liquid along X; (b) temperature variation of liquid and heating surface along X

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In